| Knowledge, attitude and perceived barriers towards practice of evidence based dentistry among Indian postgraduate dental students S Prabhu, J Joseph, S Saravanan IOSR Journal of Dental and Medical Sciences (JDMS) 4 (1), 46-51, 2012 | 23 | 2012 |
| Selection of optimal parameters in V-bending of Ti-Grade 2 sheet to minimize springback R Ramadass, S Sambasivam, K Thangavelu Journal of the Brazilian Society of Mechanical Sciences and Engineering 41, 1-11, 2019 | 18 | 2019 |
| Fatigue failure of pb-free electronic packages under random vibration loads S Saravanan, S Prabhu, R Muthukumar, S Gowtham Raj, ... International Journal for Computational Methods in Engineering Science and …, 2018 | 10 | 2018 |
| Estimation of fatigue-life of electronic packages subjected to random vibration load MI Sakri Defence Science Journal 59 (1), 58, 2009 | 9 | 2009 |
| Perceived competency towards dental practice among interns of various dental colleges in India S Prabhu, J John, S Saravanan Journal of Education and Ethics in Dentistry 2 (1), 33, 2012 | 7 | 2012 |
| Comparing the efficacy of clipping versus suture ligation of the cystic duct in laparoscopic cholecystectomy: a prospective study XLJ Leo, S Saravanan, RP Muthukumar, CVL Aishwarya, VM Pai International Journal of Scientific Study 4 (6), 130-132, 2016 | 6 | 2016 |
| Free fall drop impact analysis of board level electronic packages N Muthuram, S Saravanan Microelectronics Journal 129, 105601, 2022 | 3 | 2022 |
| Formability Studies on Titanium Grade 2 Sheet using Erichsen Cupping Test VVN Rajesh Ramadass, Saravanan Sambasivam International Journal of Mechanical Engineering 6 (3), 667 - 675, 2021 | 3* | 2021 |
| Dynamic response characteristics and fatigue life prediction of printed circuit boards for random vibration environments SGS Karthiheyan, VK Verma, S Saravanan, VP Ayyappan, ... Journal of Failure Analysis and Prevention 20, 920-929, 2020 | 3 | 2020 |
| Modeling and simulation of electronic packages subjected to drop impact MI Sakri, S Saravanan, PV Mohanram International Journal for Computational Methods in Engineering Science and …, 2008 | 3 | 2008 |
| Fatigue Prediction of Electronic Packages Subjected to Random Vibrations S Saravanan, MI Sakri, PV Mohanram Journal of microelectronics and electronic packaging 5 (1), 31-35, 2008 | 3 | 2008 |
| Predicting and improving the novel process parameters involved in deep drawing process of Inconel 718 sheet at room temperature using hybrid DNN-SSO approach K Ganesan, S Sambasivam, R Ramadass The Journal of Strain Analysis for Engineering Design 58 (8), 633-648, 2023 | | 2023 |
| A modal analysis based optimal mounting support locations of a printed circuit board N Muthuram, S Saravanan Microelectronics International 41 (2), 89-95, 2023 | | 2023 |
| Determination of Limiting Dome Height (LDH) values for Inconel 718 alloy sheet using FEA and Hemispherical Punch Method K Ganesan, S Sambasivam, R Ramadass Strojniški vestnik-Journal of Mechanical Engineering 68 (6), 439-448, 2022 | | 2022 |
| Dynamic Response Characteristics and Fatigue Life Prediction of Printed Circuit Boards for Random Vibration Environments SGSKVK Verma, S Saravanan, VPAK Sathiyaseelan | | 2020 |
| Process Variables Optimization in Lapping of EN8 Material Using Taguchi Method R Ramadass, S Sambasivam | | |
| Studies on board level electronic packages used in hand held electronic devices subjected to random vibration and drop impact loads S Saravanan Chennai, 0 | | |
