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Ved Prakash Sharma
Ved Prakash Sharma
Indian Institute of Technology Delhi
Verified email at iitd.ac.in
Title
Cited by
Cited by
Year
Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7 Cu solder joints
VP Sharma, NV Datla
Microelectronics Reliability 127, 114381, 2021
82021
Effect of bond-line thickness and mode-mixity on the fracture behavior and traction separation law of Sn-0.7 Cu solder joints
VP Sharma, NV Datla
Engineering Failure Analysis, 105855, 2021
52021
Fracture Behavior and Reliability of Low-Silver Lead-free Solder Joints
VP Sharma, N Datla
Journal of Electronic Packaging, 2022
22022
Atmospheric Water Generation with Different Grades of Molecular Sieve
VRK Manoj kumar, Avadhesh Yadav, Ravi Kant Ravi, Ved Prakash Sharma
Highly Efficient Thermal Renewable Energy Systems Design, Optimization and …, 2024
2024
Automation in Welding Industries
DK Naik, VP Sharma, R Dinesh Kumar
Automation in Welding Industry: Incorporating Artificial Intelligence …, 2024
2024
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