| Influence of imidazole and benzotriazole on electroless copper plating P Balaramesh, P Venkatesh, S Rekha Surface engineering 30 (8), 552-556, 2014 | 10 | 2014 |
| Bath parameters affecting electroless copper deposition-A review P Balaramesh, P Venkatesh, S Rekha, M Hemamalini International journal of innovative research and studies 3, 167-181, 2014 | 9 | 2014 |
| Electroless deposition of copper from methane sulphonate complexed bath S Rekha, KN Srinivasan, S John Transactions of the IMF 88 (4), 215-219, 2010 | 9 | 2010 |
| Electroless copper deposition using saccharose containing copper methane sulphonate bath with thiourea as stabilizer P Balaramesh, S Rekha, P Venkatesh, S Shanmugan Chem. Sci. Transact 3, 1214-1220, 2014 | 7 | 2014 |
| Investigation and inhibition of aluminium corrosion in methane sulphonic acid solution by organic compound SR Uma K Journal of Chemical and Pharmaceutical Research, 2015, 7(4):165-169 7 (4 …, 2015 | 6 | 2015 |
| Controlling factors affecting the stability and rate of electroless copper plating S Jothilakshmia, TM Kumarana, S Rekhab J. Indian Chem. Soc 96, 153-157, 2019 | 4 | 2019 |
| THE EFFECT OF STABILIZERS ON ELECTROLESS COPPER PLATING FROM SACCHAROSECONTAINING METHANE SULPHONATE BATHS PB S Rekha Asian Journal of Science and Technology 5 (3), 276-280, 2014 | 4 | 2014 |
| Metallization of Iron Powders by Autocatalytic Copper Plating Process S Rekha, PA Jeeva, S Karthikeyan, KN Srinivasan, D Ramkumar, ... Materials and manufacturing processes 28 (8), 905-909, 2013 | 4 | 2013 |
| Electroless copper deposition: An Experimental and Theoretical approach PAJ S.Rekha International Journal of ChemTech Research 6 (2), 1354-1361, 2014 | 3 | 2014 |
| Influences of bath chemistry and complexing agent on plating rate in electroless copper methane sulphonate bath SR T Manikanda kumaran, S. Jothilakshmi Indian chemical society 97 (11b), 2427-2432, 2020 | 2* | 2020 |
| Studies of role of additives on electroless copper methane sulphonate an eco-friendly green bath TMKSR S. Jothilakshmi Indian Journal of chemical society 97 (9b), 1514-1522, 2020 | 2 | 2020 |
| A review of green corrosion inhibitors from plant extracts of various metal in different medium. SR Jothilakshmi S, Uma K T Advances in Materials and Corrosion 3, 17-19, 2014 | 2 | 2014 |
| A novel eco-friendly bath for electroless copper deposition S Rekha, KN Srinvasan International Conference on Green technology and environmental Conservation …, 2011 | 2 | 2011 |
| Corrosion Inhibition and Adsorption Behaviour of Thiourea and 3- Mercapto Propionic Acid on Mild Steel in Methane Sulphonic Medium SR Rajapriya V, Uma K Journal of Chemical and Pharmaceutical Sciences, 27-30, 2015 | 1 | 2015 |
| Electroless copper plating deposit employing various chelators with thiourea as additive in printed circuit boards S Jothilakshmi, S Rekha AIP Conference Proceedings 2492 (1), 2023 | | 2023 |
| INVESTIGATION OF ENHANCING THE PERFORMANCE AND DEPOSITION CHARACTERISTICS OF COPPER (II) METHANE SULPHONATE SALT COMPLEXED WITH D-MANNITOL BATH. S Jothilakshmi, S Rekha, AA Kalicharan, R Ranjani Rasayan Journal of Chemistry 15 (2), 2022 | | 2022 |
| D-Mannitol a Novel Eco-friendly Complexing Material to Electroless Copper Plating for Printed Circuit Board SR JothilakshmiS, Manikandakumara T Journal of Xidian University 14 (6), 2075-2080, 2020 | | 2020 |
| A Study of the Structural, Morphological and Luminescence Characteristics of Polyvinyl pyrrolidone and Chitosan Capped Calcium Sulfide Nanoparticles S Rekha, EI Anila | | 2020 |
| The Effect of Inhibitor on the Corrosion of Aluminium in Acidic Solutions SR Uma K, Rajapriya V SOJ Materials science and engineering, 2016 | | 2016 |
| ECO-FRIENDLY NOVEL BATH FOR ELECTROLESS COPPER DEPOSITION USING FORMALDEHYDE AS REDUCING AGENT SR JothilakshmiS, Manikandakumara T IJSRME, 233-236, 2016 | | 2016 |
