| Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing H Ye, C Basaran, D Hopkins Applied Physics Letters 82 (7), 1045-1047, 2003 | 302 | 2003 |
| Extension of battery life via charge equalization control ST Hung, DC Hopkins, CR Mosling IEEE transactions on industrial electronics 40 (1), 96-104, 1993 | 264 | 1993 |
| Dynamic equalization during charging of serial energy storage elements DC Hopkins, CR Mosling, ST Hung IEEE Transactions on Industry Applications 29 (2), 363-368, 1993 | 86 | 1993 |
| Damage mechanics of microelectronics solder joints under high current densities H Ye, C Basaran, DC Hopkins, D Frear, JK Lin 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 79 | 2004 |
| Mechanical degradation of microelectronics solder joints under current stressing H Ye, C Basaran, DC Hopkins International Journal of Solids and Structures 40 (26), 7269-7284, 2003 | 74 | 2003 |
| Failure modes of flip chip solder joints under high electric current density C Basaran, H Ye, DC Hopkins, D Frear, JK Lin | 65 | 2005 |
| Numerical simulation of stress evolution during electromigration in IC interconnect lines H Ye, C Basaran, DC Hopkins IEEE Transactions on Components and Packaging Technologies 26 (3), 673-681, 2003 | 65 | 2003 |
| THE USE OF EQUALIZING CONVERTERS FOR SERIAL CHARGING OF LONG BATIXRY STRINGS DC Hopkins, CR Mosling, ST Hung | 51 | 1991 |
| Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing H Ye, C Basaran, DC Hopkins International Journal of Solids and Structures 41 (9-10), 2743-2755, 2004 | 46 | 2004 |
| Measurement of high electrical current density effects in solder joints H Ye, DC Hopkins, C Basaran Microelectronics Reliability 43 (12), 2021-2029, 2003 | 46 | 2003 |
| Evaluation and design of megahertz-frequency off-line zero-current-switched quasi-resonant converters MM Jovanovic, DC Hopkins, FCY Lee IEEE transactions on power electronics 4 (1), 136-146, 1989 | 46 | 1989 |
| Deformation of solder joint under current stressing and numerical simulation––I H Ye, C Basaran, DC Hopkins International journal of solids and structures 41 (18-19), 4939-4958, 2004 | 44 | 2004 |
| Misconception of thermal spreading angle and misapplication to IGBT power modules Y Xu, DC Hopkins 2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014, 545-551, 2014 | 43 | 2014 |
| Experimental damage mechanics of micro/power electronics solder joints under electric current stresses H Ye, C Basaran, DC Hopkins International Journal of Damage Mechanics 15 (1), 41-67, 2006 | 38 | 2006 |
| 6.0 kV, 100A, 175kHz super cascode power module for medium voltage, high power applications B Gao, AJ Morgan, Y Xu, X Zhao, DC Hopkins 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 1288-1293, 2018 | 35 | 2018 |
| Flexible epoxy-resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality X Zhao, B Gao, Y Jiang, L Zhang, S Wang, Y Xu, K Nishiguchi, Y Fukawa, ... 2017 IEEE Energy Conversion Congress and Exposition (ECCE), 4011-4018, 2017 | 35 | 2017 |
| Hybridized off-line 2-MHz zero-current-switched quasi-resonant converter DC Hopkins, MM Jovanovic, FCY Lee, FW Stephenson IEEE transactions on power electronics 4 (1), 147-154, 1989 | 34 | 1989 |
| Two-megahertz off-line hybridized quasi-resonant converter DC Hopkins, MM Jovanovicm, FC Lee, FW Stephenson 1987 2nd IEEE Applied Power Electronics Conference and Exposition, 105-114, 1987 | 34 | 1987 |
| A framework for developing power electronics packaging DC Hopkins, SCO Mathuna, AN Alderman, J Flannery APEC'98 Thirteenth Annual Applied Power Electronics Conference and …, 1998 | 33 | 1998 |
| Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module AJ Morgan, Y Xu, DC Hopkins, I Husain, W Yu 2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 2141-2146, 2016 | 30 | 2016 |
Yang XuTeslaVerified email at tesla.com
