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Indranath Dutta
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Cited by
Year
A calorimetric study of precipitation in commercial aluminium alloy 6061
I Dutta, SM Allen
Journal of materials science letters 10 (6), 323-326, 1991
4881991
Effect of reinforcement on the aging response of cast 6061 Al-Al2O3 particulate composites
I Dutta, SM Allen, JL Hafley
Metallurgical Transactions A 22, 2553-2563, 1991
2291991
A theoretical and experimental study of aluminum alloy 6061-SiC metal matrix composite to identify the operative mechanism for accelerated aging
I Dutta, DL Bourell
Materials Science and Engineering: A 112, 67-77, 1989
1871989
A constitutive model for creep of lead-free solders undergoing strain-enhanced microstructural coarsening: A first report
I Dutta
Journal of Electronic Materials 32, 201-207, 2003
1672003
Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders
I Dutta, D Pan, RA Marks, SG Jadhav
Materials Science and Engineering: A 410, 48-52, 2005
1622005
Influence of dislocation density and distribution on the aging behavior of 6061 AlSiCw composites
I Dutta, DL Bourell
Acta Metallurgica et Materialia 38 (11), 2041-2049, 1990
1501990
Impression creep characterization of rapidly cooled Sn–3.5 Ag solders
I Dutta, C Park, S Choi
Materials Science and Engineering: A 379 (1-2), 401-410, 2004
1372004
Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties
I Dutta, P Kumar, G Subbarayan
Jom 61, 29-38, 2009
1172009
Interfacial effects during thermal cycling of Cu-filled through-silicon vias (TSV)
P Kumar, I Dutta, MS Bakir
Journal of electronic materials 41, 322-335, 2012
1082012
Role of Al2O3 particulate reinforcements on precipitation in 2014 Al-matrix composites
I Dutta, CP Harper, G Dutta
Metallurgical and Materials transactions A 25, 1591-1602, 1994
1031994
An analytical study of residual stress effects on uniaxial deformation of whisker reinforced metal-matrix composites
I Dutta, JD Sims, DM Seigenthaler
Acta metallurgica et materialia 41 (3), 885-908, 1993
821993
Role of interfacial and matrix creep during thermal cycling of continuous fiber reinforced metal–matrix composites
I Dutta
Acta materialia 48 (5), 1055-1074, 2000
722000
A theoretical investigation of accelerated aging in metal-matrix composites
I Dutta, DL Bourell, D Latimer
Journal of Composite Materials 22 (9), 829-849, 1988
651988
Creep behavior of interfaces in fiber reinforced metal–matrix composites
JV Funn, I Dutta
Acta materialia 47 (1), 149-164, 1998
621998
Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders
P Kumar, Z Huang, SC Chavali, DK Chan, I Dutta, G Subbarayan, V Gupta
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 …, 2011
612011
Texture development and strain hysteresis in a NiTi shape-memory alloy during thermal cycling under load
B Ye, BS Majumdar, I Dutta
Acta Materialia 57 (8), 2403-2417, 2009
602009
Underfill constraint effects during thermomechanical cycling of flip-chip solder joints
I Dutta, A Gopinath, C Marshall
Journal of Electronic Materials 31, 253-264, 2002
602002
Effect of Ag and Cu concentrations on the creep behavior of Sn-based solders
T Chen, I Dutta
Journal of electronic materials 37, 347-354, 2008
582008
Deformation behavior of Sn-3.8 Ag-0.7 Cu solder at intermediate strain rates: Effect of microstructure and test conditions
X Long, I Dutta, V Sarihan, DR Frear
Journal of Electronic Materials 37, 189-200, 2008
562008
Kinetic evidence for the structural similarity between a supercooled liquid and an icosahedral phase in bulk metallic glass
MW Chen, I Dutta, T Zhang, A Inoue, T Sakurai
Applied Physics Letters 79 (1), 42-44, 2001
542001
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