| Effect of longitudinal wall conduction on the performance of a three-fluid cryogenic heat exchanger with three thermal communications V Krishna, S Spoorthi, PG Hegde, KN Seetharamu International Journal of Heat and Mass Transfer 62, 567-577, 2013 | 41 | 2013 |
| Effect of ambient heat-in-leak on the performance of a three fluid heat exchanger, for cryogenic applications, using finite element method V Krishna, PG Hegde, N Subramanian, KN Seetharamu International journal of heat and mass transfer 55 (21-22), 5459-5470, 2012 | 41 | 2012 |
| Transient behavior of three-fluid heat exchanger with three thermal communications under step change in inlet temperature of fluids using finite element method K Veerabhadrappa, G Vinayakaraddy, KN Seetharamu, PG Hegde, ... Applied Thermal Engineering 108, 1390-1400, 2016 | 21 | 2016 |
| Thermal analysis of micro‐channel heat exchangers with two‐phase flow using FEM P Hegde, KN Seetharamu, GA Quadir, PA Aswathanarayana, ... International Journal of Numerical Methods for Heat & Fluid Flow 15 (1), 43-60, 2005 | 14 | 2005 |
| Effects of radiation and cold wall temperature boundary conditions on natural convection in a vertical annular porous medium M Patil, PG Hegde, KN Seetharamu Journal of Applied Fluid Mechanics 6 (2), 177-189, 2013 | 8 | 2013 |
| Effect of ambient heat-in-leak on transient behaviour of three-fluid heat exchanger with two thermal communications using finite element method K Veerabhadrappa, KN Seetharamu, PG Hegde Materials Today: Proceedings 4 (9), 10596-10602, 2017 | 6 | 2017 |
| Effects of non-uniform base heating in multi stack microchannel heat sinks used for cooling high heat flux electronic chips and devices PG Hegde, KN Seetharamu 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology …, 2008 | 6 | 2008 |
| Ambient light sensor T Cogan, D Nelson, P Hegde, J Archibald, D Paterson, GR Kelly, DH Sin US Patent 11,580,901, 2023 | 3 | 2023 |
| Effect of ambient heat-in-leaks on a three-fluid cryogenic heat exchanger with two thermal communications K Venkataram, S Spoorthi, PG Hegde, KN Seetharamu Computational Thermal Sciences: An International Journal 6 (4), 2014 | 3 | 2014 |
| Two-phase stacked microchannel heat sinks for microelectronics cooling P Hegde, KN Seetharamu, PA Aswatha Narayana, Z Abdullah Journal of microelectronics and electronic packaging 2 (2), 122-131, 2005 | 3 | 2005 |
| Thermal analysis of single layer counter flow heat sinks with two phase flow P Hegde, KN Seetharamu, PAA Narayana, Z Abdullah Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004 …, 2004 | 2 | 2004 |
| Ambient radiation sensing P Hegde, D Paterson US Patent App. 18/042,483, 2023 | 1 | 2023 |
| Ambient light sensing system DH Sin, D Nelson, GR Kelly, J Archibald, P Hegde, T Cogan US Patent App. 17/265,129, 2021 | 1 | 2021 |
| Effect of ambient heat-in-leak and longitudinal wall conduction on a three-fluid parallel flow cruogenic heat exchanger V Krishna, S Spoorthi, PG Hegde, KN Seetharamu International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, 2015 | 1 | 2015 |
| Counter and parallel two-phase flow microchannel heat sinks for electronics cooling P Hegde, MZ Abdullah, KN Seetharamu, PAA Narayana International Journal of Heat Exchangers 7 (1), 57, 2006 | 1 | 2006 |
| Spectral decomposition of ambient light measurements D Nelson, GR Kelly, J Archibald, P Hegde, T Cogan US Patent 11,588,977, 2023 | | 2023 |
| Time of flight sensor D Nelson, P Hegde, T Cogan US Patent App. 17/788,143, 2023 | | 2023 |
| Method and device for estimating ambient light DH Sin, GR Kelly, P Hegde, R Owen US Patent 11,448,554, 2022 | | 2022 |
| Ambient light sensor system GR Kelly, P Hegde US Patent 11,410,611, 2022 | | 2022 |
| Time of flight sensor D Nelson, P Hegde, T Cogan US Patent App. 17/600,925, 2022 | | 2022 |
