| Terahertz characterization of dielectric substrates for component design and nondestructive evaluation of packages JA Hejase, PR Paladhi, PP Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 115 | 2011 |
| Dynamic beam shaping using a dual-band electronically tunable reflectarray antenna A Tayebi, J Tang, PR Paladhi, L Udpa, SS Udpa, EJ Rothwell IEEE Transactions on Antennas and Propagation 63 (10), 4534-4539, 2015 | 54 | 2015 |
| Dynamic beam shaping using a dual-band electronically tunable reflectarray antenna A Tayebi, J Tang, PR Paladhi, L Udpa, SS Udpa, EJ Rothwell IEEE Transactions on Antennas and Propagation 63 (10), 4534-4539, 2015 | 54 | 2015 |
| Design and development of an electrically-controlled beam steering mirror for microwave tomography A Tayebi, J Tang, PR Paladhi, L Udpa, S Udpa AIP Conference Proceedings 1650 (1), 501-508, 2015 | 9 | 2015 |
| A novel time reversal based microwave imaging system A Tayebi, PR Paladhi, L Udpa, S Udpa Progress In Electromagnetics Research C 62, 139-147, 2016 | 7 | 2016 |
| Improved backpropagation algorithms by exploiting data redundancy in limited-angle diffraction tomography PR Paladhi, A Sinha, A Tayebi, L Udpa, SS Udpa Progress In Electromagnetics Research B 66, 1-13, 2016 | 7 | 2016 |
| Terahertz packaging: Study of substrates for novel component designs JA Hejase, PR Paladhi, P Chahal 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 7 | 2010 |
| A Comprehensive Signal Integrity Study of Differential Pairs Routed within a PCB Via Field J Tang, JA Hejase, P RoyPaladhi, WD Beckir, DM Dreps 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 6 | 2018 |
| Neural Network Based Prediction of PCB Glass Weave Induced Skew DJ Boday, Z Chen, JA Hejase, RS Krabbenhoft, PR Paladhi, T Junyan US Patent App. 15/299,546, 2018 | 6 | 2018 |
| Data redundancy in diffraction tomography PR Paladhi, AK Sinha, A Tayebi, L Udpa, A Tamburrino 2015 31st International Review of Progress in Applied Computational …, 2015 | 6 | 2015 |
| Image reconstruction from highly sparse and limited angular diffraction tomography using compressed sensing approach PR Paladhi, A Tayebi, P Banerjee, L Udpa, S Udpa Progress In Electromagnetics Research 158, 21-36, 2017 | 5 | 2017 |
| Class of backpropagation techniques for limited-angle reconstruction in microwave tomography PR Paladhi, A Sinha, A Tayebi, L Udpa, S Udpa AIP Conference Proceedings 1650 (1), 509-518, 2015 | 5 | 2015 |
| The IEEE EPS packaging benchmark suite F Guo, K Aygün, WD Becker, SG Talocia, JA Hejase, WW Wong, T Zhou, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 4 | 2021 |
| Invertible neural networks for high-speed channel design & parameter distribution estimation N Ambasana, OW Bhatti, MA Dolatsara, M Swaminathan, X Yang, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 4 | 2021 |
| A neural network based method for predicting PCB glass weave induced skew JA Hejase, PR Paladhi, RS Krabbenhoft, Z Chen, J Tang, DJ Boday 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging …, 2016 | 4 | 2016 |
| Effect of NEXT coupling in close proximity to receiver of 25Gb/s bus PR Paladhi, J Hejase, N Pham, G Gholami, P Jayaraman, M Nguyen, ... 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging …, 2017 | 3 | 2017 |
| Reconstruction algorithm for limited-angle diffraction tomography for microwave NDE PR Paladhi, J Klaser, A Tayebi, L Udpa, S Udpa AIP Conference Proceedings 1581 (1), 1544-1551, 2014 | 3 | 2014 |
| A microwave tomography system using a tunable mirror for beam steering A Tayebi, J Tang, PR Paladhi, L Udpa, S Udpa AIP Conference Proceedings 1581 (1), 1537-1543, 2014 | 3 | 2014 |
| Comparison of invertible architectures for high speed channel design OW Bhatti, O Akinwande, N Ambasana, X Yang, PR Paladhi, WD Becker, ... 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 2 | 2021 |
| Parallel bayesian active learning using dropout for optimizing high-speed channel equalization X Yang, HM Torun, J Tang, PR Paladhi, Y Zhang, WD Becker, JA Hejase, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 2 | 2021 |
Jose A. HejasePrincipal Engineer, NVIDIA CorporationVerified email at ieee.org
