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Co-authors
HV PoorMichael Henry Strater University Professor, Princeton UniversityVerified email at princeton.edu- Rui ZhangNational University of SingaporeVerified email at nus.edu.sg
- Zhi-Quan LuoProfessor, The Chinese University of Hong Kong, Shenzhen, ChinaVerified email at cuhk.edu.cn
- Zhi QuanShenzhen UniversityVerified email at szu.edu.cn
- Ali H SayedDean of Engineering, EPFL, SwitzerlandVerified email at epfl.ch
- Long GaoSamsungVerified email at samsung.com
- Changchuan YinProfessor of Electrical Engineering, Beijing University of Posts and TelecommunicationsVerified email at bupt.edu.cn
- Ying-Chang LiangIEEE Fellow & Highly Cited Researcher, UESTC, ChinaVerified email at ieee.org
- Soummya KarElectrical and Computer Engineering, Carnegie Mellon UniversityVerified email at andrew.cmu.edu
- Sanjay LallStanford UniversityVerified email at stanford.edu
- Jinhua JiangQualcomm IncVerified email at qualcomm.com
- Zhi DingDistinguished Professor of Electrical and Computer Engineering, University of California DavisVerified email at ucdavis.edu
- Marwan KrunzProfessor of Electrical and Computer Engineering, University of ArizonaVerified email at arizona.edu
- Jun-Hong CuiUniversity of ConnecticutVerified email at engr.uconn.edu
- Shengli ZhouProfessor of Electrical and Computer Engineering, University of ConnecticutVerified email at engr.uconn.edu
- Zhu HanUniversity of HoustonVerified email at uh.edu
- Tie LiuTexas A&M UniversityVerified email at tamu.edu
- Lili ZhangCorporate R&D, Qualcomm Inc.Verified email at tamu.edu
- Costas N. GeorghiadesDelbert A. Whitaker Chair Professor of ECE, Texas A&M UniversityVerified email at tamu.edu
- Wing-Kin MaDepartment of Electronic Engineering, The Chinese University of Hong KongVerified email at ieee.org
Shuguang Cui
Chair Professor, School of Science and Engineering, CUHKSZ
Verified email at cuhk.edu.cn - Homepage