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Co-authors
Andrea GoldsmithProfessor of Electrical Engineering, Stanford UniversityVerified email at ee.stanford.edu- Rui ZhangNational University of SingaporeVerified email at nus.edu.sg
- Chuan HuangProfessor in University of Electronic Science and Technology of China, ChengduVerified email at uestc.edu.cn
- HV PoorMichael Henry Strater University Professor, Princeton UniversityVerified email at princeton.edu
- Zhi-Quan LuoProfessor, The Chinese University of Hong Kong, Shenzhen, ChinaVerified email at cuhk.edu.cn
- Zhi QuanShenzhen UniversityVerified email at szu.edu.cn
- Ali H SayedDean of Engineering, EPFL, SwitzerlandVerified email at epfl.ch
- Long GaoSamsungVerified email at samsung.com
- Ying-Chang LiangIEEE Fellow & Highly Cited ResearcherVerified email at ieee.org
- Soummya KarElectrical and Computer Engineering, Carnegie Mellon UniversityVerified email at andrew.cmu.edu
- Sanjay LallStanford UniversityVerified email at stanford.edu
- Jinhua JiangQualcomm IncVerified email at qualcomm.com
- Changchuan YinProfessor of Electrical Engineering, Beijing University of Posts and TelecommunicationsVerified email at bupt.edu.cn
- Marwan KrunzProfessor of Electrical and Computer Engineering, University of ArizonaVerified email at email.arizona.edu
- Zhi DingProfessor of Electrical and Computer Engineering, University of California DavisVerified email at ucdavis.edu
- Jun-Hong CuiUniversity of ConnecticutVerified email at engr.uconn.edu
- Shengli ZhouProfessor of Electrical and Computer Engineering, University of ConnecticutVerified email at engr.uconn.edu
- Zhu HanUniversity of HoustonVerified email at uh.edu
- Tie LiuTexas A&M UniversityVerified email at tamu.edu
- Lili ZhangCorporate R&D, Qualcomm Inc.Verified email at tamu.edu
