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Prabudhya Roy Chowdhury
Prabudhya Roy Chowdhury
Modeling and Hardware Engineer, IBM Research
Verified email at ibm.com
Title
Cited by
Cited by
Year
Machine learning maximized Anderson localization of phonons in aperiodic superlattices
PR Chowdhury, C Reynolds, A Garrett, T Feng, SP Adiga, X Ruan
Nano Energy 69, 104428, 2020
772020
Direct methane activation by atomically thin platinum nanolayers on two-dimensional metal carbides
Z Li, Y Xiao, PR Chowdhury, Z Wu, T Ma, JZ Chen, G Wan, TH Kim, D Jing, ...
Nature Catalysis 4 (10), 882-891, 2021
652021
Measurement of effective bulk and contact resistance of gas diffusion layer under inhomogeneous compression–Part I: Electrical conductivity
A Vikram, PR Chowdhury, RK Phillips, M Hoorfar
Journal of Power Sources 320, 274-285, 2016
542016
Wide range continuously tunable and fast thermal switching based on compressible graphene composite foams
T Du, Z Xiong, L Delgado, W Liao, J Peoples, R Kantharaj, ...
Nature communications 12 (1), 4915, 2021
482021
Measurement of effective bulk and contact resistance of gas diffusion layer under inhomogeneous compression–Part II: Thermal conductivity
PR Chowdhury, A Vikram, RK Phillips, M Hoorfar
Journal of Power Sources 320, 222-230, 2016
322016
Unexpected thermal conductivity enhancement in aperiodic superlattices discovered using active machine learning
P Roy Chowdhury, X Ruan
NPJ Computational Materials 8 (1), 12, 2022
122022
Prediction of Bi2Te3-Sb2Te3 Interfacial Conductance and Superlattice Thermal Conductivity Using Molecular Dynamics Simulations
P Roy Chowdhury, J Shi, T Feng, X Ruan
ACS Applied Materials & Interfaces 13 (3), 4636-4642, 2021
112021
Development of interatomic potentials for the complex binary compound and the prediction of thermal conductivity
PR Chowdhury, T Feng, X Ruan
Physical Review B 99 (15), 155202, 2019
102019
Fast and accurate machine learning prediction of phonon scattering rates and lattice thermal conductivity
Z Guo, P Roy Chowdhury, Z Han, Y Sun, D Feng, G Lin, X Ruan
npj Computational Materials 9 (1), 95, 2023
82023
Enhancement of Thermal Transfer From β-Ga2O3 Nano-Membrane Field-Effect Transistors to High Thermal Conductivity Substrate by Inserting an Interlayer
J Noh, PR Chowdhury, M Segovia, S Alajlouni, M Si, AR Charnas, ...
IEEE Transactions on Electron Devices 69 (3), 1186-1190, 2022
82022
Thermo-mechanical analysis of thermal compression bonding chip-join process
PR Chowdhury, K Sakuma, S Raghavan, M Bergendahl, K Sikka, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 579-585, 2022
42022
Machine learning designed and experimentally confirmed enhanced reflectance in aperiodic multilayer structures
P Roy Chowdhury, K Khot, J Song, Z He, D Kortge, Z Han, P Bermel, ...
Advanced Optical Materials 12 (4), 2300610, 2024
12024
An iterative machine learning approach for discovering unexpected thermal conductivity enhancement in aperiodic superlattices
PR Chowdhury, X Ruan
arXiv preprint arXiv:2012.08657, 2020
12020
Machine learning-based design optimization of aperiodic multilayer coatings for enhanced solar reflection
K Khot, PR Chowdhury, X Ruan
International Journal of Heat and Mass Transfer 224, 125303, 2024
2024
Monolithic stacked field effect transistor (sfet) with dual middle dielectric isolation (mdi) separation
J Zhang, R Xie, J Frougier, R Bao, PR Chowdhury
US Patent App. 17/936,417, 2024
2024
Transistors with via-to-backside power rail spacers
T Li, QIN Liqiao, DS Grant, N Jain, PR Chowdhury, S Mukesh, K Choi, ...
US Patent App. 17/950,361, 2024
2024
Via resistance to backside power rail
T Li, S Mukesh, QIN Liqiao, PR Chowdhury, K Choi, R Xie
US Patent App. 17/946,740, 2024
2024
Stacked fets with contact placeholder structures
S Mukesh, T Li, PR Chowdhury, QIN Liqiao, N Jain, R Xie
US Patent App. 17/946,546, 2024
2024
Backside contact with full wrap-around contact
PR Chowdhury, N Jain, K Choi, R Xie
US Patent App. 17/943,602, 2024
2024
Interlevel via for stacked field-effect transistor device
T Li, DS Grant, QIN Liqiao, N Jain, PR Chowdhury, S Mukesh, R Xie, ...
US Patent App. 17/662,859, 2023
2023
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