David Huitink
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Photoinduced formation of electrically conductive thin palladium nanowires on DNA scaffolds
S Kundu, K Wang, D Huitink, H Liang
Langmuir 25 (17), 10146-10152, 2009
A review of advanced thermal management solutions and the implications for integration in high-voltage packages
AC Iradukunda, DR Huitink, F Luo
IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 256-271, 2019
A multistage, semi-automated procedure for analyzing the morphology of nanoparticles
C Park, JZ Huang, D Huitink, S Kundu, BK Mallick, H Liang, Y Ding
IIE transactions 44 (7), 507-522, 2012
Design, characterization, and modeling of a chitosan microneedle patch for transdermal delivery of meloxicam as a pain management strategy for use in cattle
DA Castilla-Casadiego, H Carlton, D Gonzalez-Nino, KA Miranda-Muņoz, ...
Materials Science and Engineering: C 118, 111544, 2021
Additive manufacturing for enhancing thermal dissipation in heat sink implementation: a review
BM Nafis, R Whitt, AC Iradukunda, D Huitink
Heat Transfer Engineering 42 (12), 967-984, 2021
Formation and catalytic application of electrically conductive Pt nanowires
S Kundu, D Huitink, H Liang
The Journal of Physical Chemistry C 114 (17), 7700-7709, 2010
Design and evaluation of a 150 kva sic mosfet based three level tnpc phase-leg pebb for aircraft motor driving application
Z Yuan, A Deshpande, B Narayanasamy, H Peng, AI Emon, R Whitt, ...
2019 IEEE Energy Conversion Congress and Exposition (ECCE), 6569-6574, 2019
Photochemical formation of electrically conductive silver nanowires on polymer scaffolds
S Kundu, D Huitink, K Wang, H Liang
Journal of Colloid and interface Science 344 (2), 334-342, 2010
Transient thermal performance using phase change material integrated topology optimized heat sinks
AC Iradukunda, A Vargas, D Huitink, D Lohan
Applied Thermal Engineering 179, 115723, 2020
A system to package perspective on transient thermal management of electronics
HP De Bock, D Huitink, P Shamberger, JS Lundh, S Choi, N Niedbalski, ...
Journal of Electronic Packaging 142 (4), 2020
Stacked DBC cavitied substrate for a 15-kV half-bridge power module
A Deshpande, F Luo, A Iradukunda, D Huitink, L Boteler
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP), 12-17, 2019
Rapid solder interconnect fatigue life test methodology for predicting thermomechanical reliability
CJ Marbut, M Montazeri, DR Huitink
IEEE Transactions on Device and Materials Reliability 18 (3), 412-421, 2018
Tribochemistry as an alternative synthesis pathway
H Carlton, D Huitink, H Liang
Lubricants 8 (9), 87, 2020
Nanoparticle shape evolution identified through multivariate statistics
D Huitink, S Kundu, C Park, B Mallick, JZ Huang, H Liang
The Journal of Physical Chemistry A 114 (17), 5596-5600, 2010
Influence of crystalline polymorphism on the phase change properties of sorbitol-Au nanocomposites
X Liu, C Marbut, D Huitink, G Feng, AS Fleischer
Materials Today Energy 12, 379-388, 2019
Bayesian object classification of gold nanoparticles
BA Konomi, SS Dhavala, JZ Huang, S Kundu, D Huitink, H Liang, Y Ding, ...
Heat transfer and pressure drop performance of additively manufactured polymer heat spreaders for low-weight directed cooling integration in power electronics
R Whitt, B Nafis, D Huitink, Z Yuan, A Deshpande, B Narayanasamy, ...
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
Thermal and electrical performance in high-voltage power modules with nonmetallic additively manufactured impingement coolers
R Whitt, D Huitink, A Emon, A Deshpande, F Luo
IEEE transactions on power electronics 36 (3), 3192-3199, 2020
Degradation of polyvinyl alcohol under mechanothermal stretching
D Cristancho, Y Zhou, R Cooper, D Huitink, F Aksoy, Z Liu, H Liang, ...
Journal of molecular modeling 19, 3245-3253, 2013
Formation of electrically conductive palladium nanowires on polymer scaffolds by photochemical approach
S Kundu, D Huitink, H Liang
Colloids and Surfaces A: Physicochemical and Engineering Aspects 360 (1-3 …, 2010
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