| Electromagnetic interference shielding of polycarbonate/GNP nanocomposites in X-band P Nimbalkar, A Korde, RK Goyal Materials Chemistry and Physics 206, 251-258, 2018 | 36 | 2018 |
| Advances in high performance RDL technologies for enabling IO density of 500 IOs/mm/layer and 8-μm IO pitch using low-k dielectrics F Liu, R Zhang, BH DeProspo, S Dwarakanath, P Nimbalkar, ... 2020 IEEE 70th electronic components and technology conference (ECTC), 1132-1139, 2020 | 18 | 2020 |
| Glass panel packaging, as the most leading-edge packaging: Technologies and applications R Tummala, B Deprospo, S Dwarakanath, S Ravichandran, P Nimbalkar, ... 2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-5, 2020 | 9 | 2020 |
| Effect of titanium-polymer interactions on adhesion of polymer-copper redistribution layers in advanced packaging P Nimbalkar, C Blancher, M Kathaperumal, M Swaminathan, R Tummala IEEE Transactions on Device and Materials Reliability 22 (1), 59-64, 2022 | 6 | 2022 |
| Fabrication and reliability demonstration of 5μm redistribution layer using low-stress dielectric dry film P Nimbalkar, F Liu, A Watanabe, D Weyers, M Kathaperumal, CP Lin, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 62-67, 2020 | 6 | 2020 |
| Novel zero side-etch process for< 1μm package redistribution layers P Nimbalkar, P Bhaskar, C Blancher, M Kathaperumal, M Swaminathan, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2168-2173, 2022 | 5 | 2022 |
| A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5 D/3D Interposers F Liu, P Nimbalkar, N Aslani-Amoli, M Kathaperumal, R Tummala, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 4 | 2023 |
| Reliability modeling of micro-vias in high-density redistribution layers P Nimbalkar, M Kathaperumal, F Liu, M Swaminathan, R Tummala 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 983-988, 2021 | 4 | 2021 |
| Evaluation of Parylene-HT as Dielectric for Application in Advanced Package Substrates P Nimbalkar, M Aguebor, M Kathaperumal, M Swaminathan, R Tummala 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1603-1608, 2023 | 2 | 2023 |
| A new and historic packaging era R Tummala, M Swaminathan, P Nimbalkar Chip Scale Review, Volume 26, Number 2, 2022 | 2 | 2022 |
| A review of polymer dielectrics for redistribution layers in interposers and package substrates P Nimbalkar, P Bhaskar, M Kathaperumal, M Swaminathan, RR Tummala Polymers 15 (19), 3895, 2023 | 1 | 2023 |
| Methods for etch barrier deposition and devices made according to the same P Nimbalkar, M Kathaperumal, M Swaminathan, RR Tummala US Patent App. 18/182,032, 2023 | | 2023 |
| Maskless Lithography for High-Density Package Redistribution Layers P Murali, P Nimbalkar, M Kathaperumal, MD Losego, R Tummala, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 147-151, 2023 | | 2023 |
| Two-/Multi-Photon Imaging for Characterization of Fine Line Features and Microvias in Advanced Packaging M Kathaperumal, B Nie, P Bhaskar, C Blancher, P Nimbalkar, F Liu, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1674-1679, 2022 | | 2022 |
| Electromagnetic Interference (EMI) shielding characteristics of PC/Graphene nanocomposites in X-Band P Nimbalkar, A Korde, RK Goyal | | |
R.K. Goyal, ProfessorDept. of Metallurgical and Materials Engg., Malaviya National Institute of Technology JaipurVerified email at mnit.ac.in
