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Pratik Nimbalkar
Pratik Nimbalkar
Verified email at gatech.edu
Title
Cited by
Cited by
Year
Electromagnetic interference shielding of polycarbonate/GNP nanocomposites in X-band
P Nimbalkar, A Korde, RK Goyal
Materials Chemistry and Physics 206, 251-258, 2018
382018
Advances in high performance RDL technologies for enabling IO density of 500 IOs/mm/layer and 8-μm IO pitch using low-k dielectrics
F Liu, R Zhang, BH DeProspo, S Dwarakanath, P Nimbalkar, ...
2020 IEEE 70th electronic components and technology conference (ECTC), 1132-1139, 2020
202020
Glass panel packaging, as the most leading-edge packaging: Technologies and applications
R Tummala, B Deprospo, S Dwarakanath, S Ravichandran, P Nimbalkar, ...
2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-5, 2020
142020
A critical review of lithography methodologies and impacts of topography on 2.5-D/3-D interposers
F Liu, P Nimbalkar, N Aslani-Amoli, M Kathaperumal, R Tummala, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023
92023
Effect of titanium-polymer interactions on adhesion of polymer-copper redistribution layers in advanced packaging
P Nimbalkar, C Blancher, M Kathaperumal, M Swaminathan, R Tummala
IEEE Transactions on Device and Materials Reliability 22 (1), 59-64, 2022
82022
Fabrication and reliability demonstration of 5μm redistribution layer using low-stress dielectric dry film
P Nimbalkar, F Liu, A Watanabe, D Weyers, M Kathaperumal, CP Lin, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 62-67, 2020
72020
A review of polymer dielectrics for redistribution layers in interposers and package substrates
P Nimbalkar, P Bhaskar, M Kathaperumal, M Swaminathan, RR Tummala
Polymers 15 (19), 3895, 2023
62023
Novel zero side-etch process for< 1μm package redistribution layers
P Nimbalkar, P Bhaskar, C Blancher, M Kathaperumal, M Swaminathan, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2168-2173, 2022
62022
Reliability modeling of micro-vias in high-density redistribution layers
P Nimbalkar, M Kathaperumal, F Liu, M Swaminathan, R Tummala
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 983-988, 2021
52021
Evaluation of Parylene-HT as Dielectric for Application in Advanced Package Substrates
P Nimbalkar, M Aguebor, M Kathaperumal, M Swaminathan, R Tummala
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1603-1608, 2023
22023
A new and historic packaging era
R Tummala, M Swaminathan, P Nimbalkar
Chip Scale Review, Volume 26, Number 2, 2022
22022
Bayesian Optimization of Large Glass Package Architecture for System-Level Reliability in High-Performance Computing Applications
ET Surillo, RA Sosa, C Molina, H Park, P Nimbalkar, S Srirangan, ...
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 246-253, 2024
12024
Characterization of Warpage of Ultra-Low-K Dielectric Materials and Correlation with Modulus and Coefficient of Thermal Expansion
M Kathaperumal, P Bhaskar, AJ Toro, P Nimbalkar, L Dahal, MS Bakir
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1958-1962, 2024
2024
Methods for etch barrier deposition and devices made according to the same
P Nimbalkar, M Kathaperumal, M Swaminathan, RR Tummala
US Patent App. 18/182,032, 2023
2023
Maskless Lithography for High-Density Package Redistribution Layers
P Murali, P Nimbalkar, M Kathaperumal, MD Losego, R Tummala, ...
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 147-151, 2023
2023
Two-/Multi-Photon Imaging for Characterization of Fine Line Features and Microvias in Advanced Packaging
M Kathaperumal, B Nie, P Bhaskar, C Blancher, P Nimbalkar, F Liu, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1674-1679, 2022
2022
Electromagnetic Interference (EMI) shielding characteristics of PC/Graphene nanocomposites in X-Band
P Nimbalkar, A Korde, RK Goyal
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