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Woong Hwan Ryu
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6b9b encoding scheme for improving single-ended interface bandwidth and reducing power consumption without pin count increase
B Wang, M Wang, WH Ryu
2007 IEEE Electrical Performance of Electronic Packaging, 25-28, 2007
642007
Effects of on-chip and off-chip decoupling capacitors on electromagnetic radiated emission
J Kim, H Kim, W Ryu, J Kim, YH Yun, SH Kim, SH Ham, HK An, YH Lee
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat …, 1998
571998
Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications
MJ Yim, W Ryu, YD Jeon, J Lee, S Ahn, J Kim, KW Paik
IEEE Transactions on Components and Packaging Technologies 22 (4), 575-581, 1999
511999
An efficient crosstalk parameter extraction method for high-speed interconnection lines
M Sung, W Ryu, H Kim, J Kim, J Kim
IEEE Transactions on advanced packaging 23 (2), 148-155, 2000
482000
High-Frequency Simultaneous Switching Output Noise (SSO) Simulation Methodology for a DDR333/400 Data Interface
WH Ryu, H Fahmy, H Maramis
Jun 27, 1-6, 2002
472002
Separated role of on-chip and on-PCB decoupling capacitors for reduction of radiated emission on printed circuit board
JH Kim, B Choi, H Kim, W Ryu, Y Yun, S Ham, SH Kim, Y Lee, J Kim
2001 IEEE EMC International Symposium. Symposium Record. International …, 2001
352001
RF interconnect for multi-Gbit/s board-level clock distribution
W Ryu, J Lee, H Kim, S Ahn, N Kim, B Choi, D Kam, J Kim
IEEE transactions on advanced packaging 23 (3), 398-407, 2000
352000
Power integrity for I/O interfaces: with signal integrity/power integrity co-design
VS Pandit, WH Ryu, MJ Choi
Pearson Education, 2010
322010
Embedded microstrip interconnection lines for gigahertz digital circuits
W Ryu, SH Baik, H Kim, J Kim, M Sung, J Kim
IEEE transactions on advanced packaging 23 (3), 495-503, 2000
312000
Electrical and thermal modelling of QFN packages
ACW Lu, DJ Xie, ZF Shi, W Ryu
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000 …, 2000
302000
Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection
N Kim, M Sung, H Kim, S Baek, W Ryu, JG An, J Kim
IEEE transactions on advanced packaging 24 (3), 260-267, 2001
292001
Over GHz low-power RF clock distribution for a multiprocessor digital system
W Ryu, ALC Wai, F Wei, WL Lai, J Kim
IEEE Transactions on advanced packaging 25 (1), 18-27, 2002
232002
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm
W Ryu, MJ Yim, S Ahn, J Lee, W Kim, KW Paik, J Kim
IEEE Transactions on Components and Packaging Technologies 23 (3), 542-545, 2000
212000
A co-design methodology of signal integrity and power integrity
WH Ryu
Proc. of DesignCon 2006, 2006
182006
Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls
S Ahn, W Ryu, MJ Yim, J Lee, YD Jeon, W Kim, KW Paik, J Kim
Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology …, 1999
131999
Controllable parameters identification for high speed channel through signal-power integrity combined analysis
MJ Choi, VS Pandit, WH Ryu
2008 58th Electronic Components and Technology Conference, 658-663, 2008
102008
High speed memory interface
HM Fahmy, WH Ryu
US Patent 7,106,610, 2006
102006
Voltage plane with high impedance link
WH Ryu, HM Fahmy
US Patent 6,822,526, 2004
102004
Microwave frequency interconnection line model of a wafer level package
J Lee, W Ryu, J Kim, J Lee, N Kim, J Pak, JM Kim, J Kim
IEEE transactions on advanced packaging 25 (3), 356-364, 2002
92002
High-frequency electrical performance of a new high-density multiple line grid array (MLGA) package
S Ahn, JW Lee, J Kim, W Ryu, YS Kim, CK Yoon, J Kim
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat …, 2000
82000
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