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Somaiah Nalla, PhD
Somaiah Nalla, PhD
Indian Institute of Science, Bangalore
Verified email at iisc.ac.in
Title
Cited by
Cited by
Year
Magnetic and magnetoelastic properties of Zn-doped cobalt-ferrites—CoFe2− xZnxO4 (x= 0, 0.1, 0.2, and 0.3)
N Somaiah, TV Jayaraman, PA Joy, D Das
Journal of Magnetism and Magnetic Materials 324 (14), 2286-2291, 2012
1812012
Electric current induced forward and anomalous backward mass transport
N Somaiah, D Sharma, P Kumar
Journal of Physics D: Applied Physics 49 (20), 20LT01, 2016
112016
Effect of substrate surface roughness on electric current induced flow of liquid metals
S Talukder, N Somaiah, P Kumar
Applied Physics Letters 102 (5), 2013
112013
Inverse Blech Length Phenomenon in Thin-Film Stripes
N Somaiah, P Kumar
Physical Review Applied 10 (5), 054052, 2018
62018
Tuning electromigration-thermomigration coupling in Cu/W Blech structures
N Somaiah, P Kumar
Journal of Applied Physics 124 (18), 2018
62018
Effect of Thermomigration–Electromigration Coupling on Mass Transport in Cu Thin Films
N Somaiah, P Kumar
Journal of Electronic Materials 49, 96-108, 2020
32020
Effects of an interfacial layer on stress relaxation mechanisms active in the Cu–Si thin film system during thermal cycling
N Somaiah, A Kanjilal, P Kumar
MRS Communications 10 (1), 164-172, 2020
12020
Tuning sample length effect on mass transport in current carrying Cu-Si thin-film systems via interfacial engineering
N Somaiah, P Kumar
Nanotechnology 30 (48), 485704, 2019
12019
Carrier transport in LPCVD grown Ge-doped β-Ga2O3/4H-SiC isotype heterojunction
T Saquib, F Akyol, H Ozden, N Somaiah, J Sahoo, R Muralidharan, ...
Journal of Applied Physics 135 (6), 2024
2024
Mass Transport in Cu-Interlayer-Si Systems under Various Thermo-Electro-Mechanical Excursions
N Somaiah
2021
Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material
D Sharma, A Jain, N Somaiah, PR Narayanan, P Kumar
Journal of Electronic Materials 47, 4863-4874, 2018
2018
Observation of Inverse Blech Length Effect during Electromigration of Cu Thin Film
N Somaiah, P Kumar
International Conference on Microelectronics and Microsystems Technology 11 …, 2017
2017
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