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Co-authors
- Asegun HenryMassachusetts Institute of TechnologyVerified email at mit.edu
- Adri van DuinDistinguished Professor of Mechanical Engineering, Penn State UniversityVerified email at psu.edu
- Vigor YangGeorgia Institute of TechnologyVerified email at gatech.edu
- Kiarash GordizResearch Scientist, MITVerified email at mit.edu
- Freddy DeAngelisGeorgia TechVerified email at gatech.edu
- Andrew RohskopfApple Inc.Verified email at alum.mit.edu
- Paul R. C. KentOak Ridge National LaboratoryVerified email at ornl.gov
- Alan J. H. McGaugheyCarnegie Mellon UniversityVerified email at cmu.edu
- Austin J. MinnichProfessor of Mechanical Engineering and Applied Physics, California Institute ofVerified email at caltech.edu
- Hassnain AsgarCornell UniversityVerified email at cornell.edu
- Dilip Srinivas SundaramAssociate Professor, Indian Institute of Technology GandhinagarVerified email at iitgn.ac.in
- Seung Ho HahnMechatronics Research, Samsung ElectronicsVerified email at samsung.com
- John KaszubaProfessor of Geochemistry, University of WyomingVerified email at uwyo.edu
- Bladimir Ramos AlvaradoAssociate Professor, Department of Mechanical Engineering, Penn StateVerified email at psu.edu
- C. Ulises Gonzalez-ValleAssistant Professor, UWGBVerified email at uwgb.edu
- Shenghong JuShanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
- Junichiro ShiomiThe University of TokyoVerified email at photon.t.u-tokyo.ac.jp
- Hamid Reza SeyfApple Inc, Georgia Institute of Technology