CoMeT: An integrated interval thermal simulation toolchain for 2D, 2.5 D, and 3D processor-memory systems L Siddhu, R Kedia, S Pandey, M Rapp, A Pathania, J Henkel, PR Panda ACM Transactions on Architecture and Code Optimization (TACO) 19 (3), 1-25, 2022 | 17 | 2022 |
NeuroMap: Efficient task mapping of deep neural networks for dynamic thermal management in high-bandwidth memory S Pandey, PR Panda IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2022 | 8 | 2022 |
NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized Prefetching S Pandey, L Siddhu, PR Panda ACM Transactions on Design Automation of Electronic Systems 29 (1), 1-35, 2023 | 1 | 2023 |
3D-TemPo: Optimizing 3D DRAM Performance Under Temperature and Power Constraints S Pandey, S Sethi, PR Panda IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2024 | | 2024 |
Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure L Siddhu, A Bagchi, R Kedia, I Ahmad, S Pandey, PR Panda ACM Transactions on Embedded Computing Systems 22 (6), 1-27, 2023 | | 2023 |
Education Abstract: Thermal Challenges and Mitigation in 3D DRAM PR Panda, S Pandey Proceedings of the 2023 International Conference on Hardware/Software …, 2023 | | 2023 |
P4+ BACUS for developing high-performance software switches A Bhardwaj, S Pandey, A Panda, S Bansal | | |
COP: Compiler Optimizations to Reduce Memory Stalls for Network Pipelines Written in P4 S Pandey, A Bhardwaj, A Panda, S Bansal | | |