| Direct bonded heterogeneous integration (DBHi) Si bridge K Sikka, R Bonam, Y Liu, P Andry, D Parekh, A Jain, M Bergendahl, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 136-147, 2021 | 34 | 2021 |
| Ice formation modes during flow freezing in a small cylindrical channel A Jain, A Miglani, Y Huang, JA Weibel, SV Garimella International Journal of Heat and Mass Transfer 128, 836-848, 2019 | 23 | 2019 |
| Laser vs. blade dicing for direct bonded heterogeneous integration (DBHi) Si bridge A Jain, K Sikka, JM Gomez, D Parekh, M Bergendahl, J van Borkulo, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1125-1130, 2021 | 9 | 2021 |
| Super fine jet underfill dispense technique for robust micro joint in direct bonded heterogeneous integration (DBHi) silicon bridge packages A Horibe, C Marushima, T Watanabe, A Jain, E Turcotte, I De Sousa, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 631-634, 2022 | 7 | 2022 |
| The effect of channel diameter on flow freezing in microchannels A Jain, A Miglani, JA Weibel, SV Garimella International Journal of Heat and Mass Transfer 157, 119718, 2020 | 5 | 2020 |
| Integrated Stacked Silicon Microcoolers M Bergendahl, A Jain, D Parekh, I Saraf, R Bonam, K Sikka, D Goldfarb, ... 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 4 | 2021 |
| Analytical solution for a chip temperature distribution in a multilayer chip-package with thermal warpage A Jain, DP Parekh, M Bergendahl, K Sikka 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 3 | 2021 |
| Thermal performance characterization of stacked silicon microcoolers for spatially non-uniform power dissipation A Jain, DP Parekh, M Bergendahl, K Sikka, R Miyazawa 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 2 | 2021 |
| Characterization of flow freezing in small channels for ice valve applications A Jain Purdue University, 2019 | 2 | 2019 |
| Visualization of ice formation modes and flow blockage during freezing of water flowing in a microchannel A Jain, Y Huang, JA Weibel, SV Garimella Heat Transfer Summer Conference 50336, V002T08A015, 2016 | 2 | 2016 |
| CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs R Miyazawa, H Mori, A Jain, M Farooq, T Hisada InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2023 | 1 | 2023 |
| A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications A Jain, K Sikka, S Li, JM Gomez, M Bergendahl, S Skordas, J Van Borkulo, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 24-29, 2022 | 1 | 2022 |
| Surface Silicon Bridge Direct Bonded Heterogeneous Integration (s-DBHi) K Sikka, I De Sousa, A Jain, C Marushima, T Aoki, S Kohara, H Mori, ... 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM …, 2022 | 1 | 2022 |
| High aspect ratio buried power rail metallization S Mukesh, DS Grant, FL LIE, H Shobha, TS Devarajan, A Jain US Patent US20230402378A1, 2023 | | 2023 |
| Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages PR Chowdhury, S Raghavan, L Darling, A Jain, PR Chowdhury, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1418-1425, 2023 | | 2023 |
| A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning S Raghavan, A Jain, PR Chowdhury, K Sakuma, R Doll, K Biesheuvel, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 139-146, 2023 | | 2023 |
| Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications A Jain, R Miyazawa, S Raghavan, PR Chowdhury, MG Farooq, A Kumar, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1219-1225, 2023 | | 2023 |
| Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling CCB Pulido, S Kohara, A Jain, T Wassick, D Taneja, P McInnes, A Horibe, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1053-1059, 2023 | | 2023 |
| Thermal modeling of Direct Bonded Heterogenous Integration (DBHi) MCM package with Si microcooler R Miyazawa, T Hisada, M Bergendah, A Jain, K Sikka 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | | 2022 |
| Ice valve formation in a microfluidic chip A Jain, A Miglani, JA Weibel, SV Garimella ASME Summer Heat Transfer Conference, SHTC2020-9205, 2020 | | 2020 |
Kamal SikkaSenior Technical Staff Member, IBMVerified email at us.ibm.com
