| Drop shock reliability of lead-free alloys-effect of micro-additives RS Pandher, BG Lewis, R Vangaveti, B Singh 2007 Proceedings 57th Electronic Components and Technology Conference, 669-676, 2007 | 139 | 2007 |
| Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration P Lall, D Iyengar, S Shantaram, R Pandher, D Panchagade, J Suhling 2008 58th Electronic Components and Technology Conference, 1036-1047, 2008 | 89 | 2008 |
| Reliability of Pb-Free Solder Alloys in Demanding BGA and CSP Applications, Electronic Systems R Pandher, R Healey 58th Electronic Component & Technology Conference, Orlando, Florida, 2018-2023, 2008 | 76 | 2008 |
| Method for photo-curing polymerizable compositions with pulsed light N Melikechi, RS Pandher US Patent 7,407,616, 2008 | 72 | 2008 |
| Interrogation of system state for damage assessment in lead-free electronics subjected to thermo-mechanical loads P Lall, C Bhat, M Hande, V More, R Vaidya, R Pandher, J Suhling, ... 2008 58th Electronic Components and Technology Conference, 918-929, 2008 | 63 | 2008 |
| iNEMI Pb-free alloy alternatives project report: State of the industry G Henshall, R Healey, RS Pandher, K Sweatman, K Howell, R Coyle, ... Proceedings SMTA International, 2008 | 56 | 2008 |
| Studies on recombining Al‐plasma using 1.06, 0.532, 0.355, and 0.266 μm laser radiation R Tambay, R Singh, RK Thareja Journal of applied physics 72 (3), 1197-1199, 1992 | 39 | 1992 |
| Effect of Silver in common lead-free alloys R Pandher, T Lawlor Proceedings of the International Conference on Soldering and Reliabilty, 1-14, 2009 | 34 | 2009 |
| Solder alloy AE Ingham, G Campbell, BG Lewis, B Singh, JP Laughlin, R Pandher US Patent 9,221,131, 2015 | 30 | 2015 |
| iNEMI Pb-Free alloy characterization project report: part I–program goals, experimental structure, alloy characterization, and test protocols for accelerated temperature cycling G Henshall, J Miremadi, R Parker, R Coyle, J Smetana, J Nguyen, W Liu, ... Proceedings of SMTAI 2012, 335-347, 2012 | 26 | 2012 |
| iNEMI Pb-free alloy characterization project report: Part III–thermal fatigue results for low Ag alloys K Sweatman, K Howell, R Coyle, R Parker, G Henshall, J Smetana, ... Proceeding of SMTAi 2012, 2012 | 25 | 2012 |
| iNEMI lead-free alloy alternatives project report: thermal fatigue experiments and alloy test requirements G Henshall, J Sweatman, R Coyle, R Parker, S Tisdale, F Hua, W Liu, ... Proceedings of the SMTAI, 317-324, 2009 | 24 | 2009 |
| Hyperfine structure studies of niobium using laser Optogalvanic Spectroscopy. R Singh, GN Rao Physica Scripta 40 (2), 170, 1989 | 24 | 1989 |
| Hyperfine-structure studies of 93Nb by laser optogalvanic spectroscopy R Singh, RK Thareja, GN Rao JOSA B 9 (4), 493-497, 1992 | 23 | 1992 |
| Development of low-temperature drop shock resistant solder alloys for handheld devices M Ribas, S Chegudi, A Kumar, R Pandher, R Raut, S Mukherjee, S Sarkar, ... 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 48-52, 2013 | 22 | 2013 |
| Assembly Interconnect Reliability in Solid State Lighting Applications–Part 1 R Raut, R Bhatkal, W Bent, B Singh, S Chegudi, R Pandher, J Kolbe, ... SMTA Pan Pacific Conference, Hawaii, 2011 | 18 | 2011 |
| Thermo-mechanical reliability of SAC leadfree alloys P Lall, R Hinshaw, R Pandher, M Harsha, J Suhling 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 18 | 2010 |
| Addressing opportunities and risks of Pb-free solder alloy alternatives G Henshall, R Healey, RS Pandher, K Sweatman, K Howell, R Coyle, ... 2009 European Microelectronics and Packaging Conference, 1-11, 2009 | 18 | 2009 |
| Mode hopping in external-cavity diode lasers S Sivaprakasam, R Saha, PA Lakshmi, R Singh Optics letters 21 (6), 411-413, 1996 | 18 | 1996 |
| Laser optogalvanic spectroscopy of ScI: Hyperfine-structure studies R Singh, GN Rao, RK Thareja JOSA B 8 (1), 12-16, 1991 | 18 | 1991 |
Morgana RibasSr. R&D Manager, Metals Technology, MacDermid Alpha Electronics SolutionsVerified email at alphaassembly.com
