Cheolmin Shin
Cheolmin Shin
Ph. D Course, Department of Mechanical Engineering, Sungkyunkwan University
Verified email at skku.edu - Homepage
Title
Cited by
Cited by
Year
Near-UV-emitting graphene quantum dots from graphene hydrogels
H Qin, T Gong, Y Jin, Y Cho, C Shin, C Lee, T Kim
Carbon 94, 181-188, 2015
312015
Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process
C Shin, H Qin, S Hong, S Jeon, A Kulkarni, T Kim
Journal of Mechanical Science and Technology 30 (12), 5659-5665, 2016
102016
Investigation of the pad-conditioning performance deterioration in the chemical mechanical polishing process
H Kim, S Hong, C Shin, Y Jin, DH Lim, J Kim, H Hwang, T Kim
Wear 392, 93-98, 2017
92017
Chemical amination via cycloaddition of graphene for use in a glucose sensor
H Qin, T Hwang, C Ahn, JA Kim, Y Jin, Y Cho, C Shin, T Kim
Journal of nanoscience and nanotechnology 16 (5), 5034-5037, 2016
72016
A conductive copolymer based on graphene oxide and poly (amidoxime-pyrrole) for adsorption of uranium (VI)
H Qin, Y Jin, T Gong, Y Cho, C Ahn, C Shin, C Lee, T Kim
Nano 11 (04), 1650045, 2016
72016
Light-sensitive silicon nanowire array field effect transistor for glucose detection
C Ahn, A Kulkarni, HU Kim, C Shin, Y Xu, S Jung, H Kim, M Lee, T Kim
Nano 9 (08), 1450099, 2014
72014
A simple and economical method using graphene oxide for the fabrication of water/oil separation papers
H Qin, T Gong, Y Cho, C Shin, C Lee, T Kim
RSC advances 5 (71), 57860-57864, 2015
62015
Diamond structure-dependent pad and wafer polishing performance during chemical mechanical polishing
C Shin, A Kulkarni, K Kim, H Kim, S Jeon, E Kim, Y Jin, T Kim
The International Journal of Advanced Manufacturing Technology 97 (1), 563-571, 2018
52018
Deposition of controllable nanoparticles by hybrid aerodynamic and electrostatic spray
B Seong, S Ha, HU Kim, C Shin, T Kim, D Byun
Nano 12 (02), 1750023, 2017
42017
Optimal shape of retainer ring considering edge exclusion and slurry film thickness
J Park, C Shin, T Kim, H Qin
2015 International Conference on Planarization/CMP Technology (ICPT), 1-2, 2015
42015
Effect of Copper Foil Crystal Orientation on Graphene Quality Synthesized by Chemical Vapor Deposition
Y Jin, HU Kim, S Hong, C Shin, A Kulkarni, T Kim
Journal of nanoscience and nanotechnology 19 (9), 5942-5948, 2019
32019
Evaluation of Size Distribution Measurement Methods for Sub-100 nm Colloidal Silica Nanoparticles and Its Application to CMP Slurry
C Shin, J Choi, D Kwak, J Kim, J Yang, S Chae, T Kim
ECS Journal of Solid State Science and Technology 8 (5), P3195, 2019
32019
Effect of Ceria Abrasive Synthesized by Supercritical Hydrothermal Method for Chemical Mechanical Planarization
J Choi, C Shin, J Yang, SK Chae, T Kim
ECS Journal of Solid State Science and Technology 8 (5), P3128, 2019
22019
Monitoring the physicochemical degradation of polishing pad soaked in hydrogen peroxide during chemical mechanical polishing
C Shin, H Chung, E Kim, S Hong, D Kwak, Y Jin, A Kulkarni, T Kim
ECS Journal of Solid State Science and Technology 7 (2), P77, 2018
12018
Trace metals optimization in ceria abrasive for material removal rate enhancement during ILD CMP
C Shin, J Choi, H Kim, A Kulkarni, D Kwak, E Kim, T Kim
ECS Journal of Solid State Science and Technology 6 (10), P687, 2017
12017
Control of Silica Particle Deposition for Fabrication of Post CMP Cleaning Ability Evaluation Wafer
Y Cho, SK Chae, C Shin, Y Jin, T Kim
ICPT 2017; International Conference on Planarization/CMP Technology, 1-3, 2017
2017
Modified Kinematic Model for Predicting Contact Points of Conditioner in CMP
J Choi, E Kim, C Shin, Y Jin, T Kim
ICPT 2017; International Conference on Planarization/CMP Technology, 1-3, 2017
2017
Evaluation of Polyurethane Pads Properties for Effective Use in Planarization Process
H Chung, C Shin, Y Jin, T Kim
ICPT 2017; International Conference on Planarization/CMP Technology, 1-3, 2017
2017
Graphene Quantum Dots Prepared from Graphene Hydrogels Basing on Hydrothermal Method
H Qin, T Gong, J Liu, Y Jin, Y Cho, C Shin, C Lee, T Kim
ECS Meeting Abstracts, 608, 2015
2015
Characteristic of pad cut rate as conditioner structure
C Shin, S Jang, H Qin, J Yang, T Kim
Proceedings of International Conference on Planarization/CMP Technology 2014 …, 2014
2014
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Articles 1–20