| Effect of ZnO nanofiller in the XLPE matrix on electrical tree characteristics NS Mansor, NSM Nazar, MA Azmi, NZI Hashim, D Ishak, M Jaafar, ... IEEE Access 8, 117574-117581, 2020 | 9 | 2020 |
| Molded underfill (MUF) encapsulation for flip-chip package: A numerical investigation MA Azmi, MK Abdullah, MZ Abdullah, ZM Ariff, AA Saad, MF Hamid, ... AIP Conference Proceedings 1865 (1), 2017 | 6 | 2017 |
| Flow Behavior Analysis of Emc in Molded Underfill (Muf) Encapsulation for Multi Flip-Chip Package MA Azmi, MK Abdullah, MZ Abdullah, ZM Ariff, MA Ismail, MSA Aziz Journal of Physics: Conference Series 1082 (1), 012015, 2018 | 4 | 2018 |
| Numerical Study of Mold Filling during Encapsulation Process MF Hamid, MK Abdullah, H Yusoff, SM Firdaus, MZ Abdullah, ZM Ariff, ... Applied Mechanics and Materials 786, 318-322, 2015 | 2 | 2015 |
| Numerical investigation on rheology models during encapsulation of moulded underfill (MUF) for flip-chip package MA Azmi, MZ Abdullah, RK Shuib, ZM Ariff, WK Loh, RC Ooi, CK Ooi, ... Polymer Bulletin 81 (3), 2385-2406, 2024 | | 2024 |
| Numerical Investigation on the Polymer Flow in a Restriction Flow Path Check for updates MA Azmi, NF Fishal, ZM Ariff, RK Shuib, A Rusli, KMK Ishak, MD Shafiq, ... Proceedings of the 19th Asian Workshop on Polymer Processing (AWPP 2022 …, 2023 | | 2023 |
| Numerical Investigation on the Polymer Flow in a Restriction Flow Path MA Azmi, NF Fishal, ZM Ariff, RK Shuib, A Rusli, KMK Ishak, MD Shafiq, ... Asian Workshop on Polymer Processing, 59-68, 2022 | | 2022 |
| The study of dynamic dispensing pattern effects on capillary driven underfill process NAR Aifa, SR Khimi, KIK Marsilla, ZAA Hamid, MK Abdullah, MA Azmi Materials Today: Proceedings 66, 3116-3119, 2022 | | 2022 |
MK AbdullahSr. Lecturer, Material & Min. Res. Engineering, Universiti Sains MalaysiaVerified email at usm.my
MK AbdullahSr. Lecturer, Material & Min. Res. Engineering, Universiti Sains MalaysiaVerified email at usm.my