| Wireless power charging apparatus and method of charging the apparatus MH Kim, JH Kim, DS Ahn US Patent 9,197,095, 2015 | 259 | 2015 |
| Analytical expressions for maximum transferred power in wireless power transfer systems S Kong, M Kim, K Koo, S Ahn, B Bae, J Kim 2011 IEEE International Symposium on Electromagnetic Compatibility, 379-383, 2011 | 72 | 2011 |
| A compact and wideband electromagnetic bandgap structure using a defected ground structure for power/ground noise suppression in multilayer packages and PCBs M Kim, K Koo, C Hwang, Y Shim, J Kim, J Kim IEEE Transactions on Electromagnetic Compatibility 54 (3), 689-695, 2012 | 50 | 2012 |
| A Wideband and Compact EBG Structure With a Circular Defected Ground Structure M Kim, DG Kam IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (3 …, 2014 | 32 | 2014 |
| A Compact EBG Structure With Wideband Power/Ground Noise Suppression Using Meander-Perforated Plane M Kim IEEE Transactions on Electromagnetic Compatibility, 2015 | 31 | 2015 |
| Impact of pcb design on switching noise and emi of synchronous dc-dc buck converter K Koo, J Kim, M Kim, J Kim 2010 IEEE International Symposium on Electromagnetic Compatibility, 67-71, 2010 | 25 | 2010 |
| Vertical stepped impedance EBG (VSI-EBG) structure for wideband suppression of simultaneous switching noise in multilayer PCBs M Kim, K Koo, Y Shim, C Hwang, JS Pak, S Ahn, J Kim IEEE transactions on electromagnetic compatibility 55 (2), 307-314, 2012 | 24 | 2012 |
| Through-silicon via (TSV) depletion effect J Cho, M Kim, J Kim, JS Pak, J Kim, H Lee, J Lee, K Park 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging …, 2011 | 22 | 2011 |
| Wideband and Compact EBG Structure With Balanced Slots M Kim, DG Kam IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (6 …, 2015 | 19 | 2015 |
| Periodically corrugated reference planes for common-mode noise suppression in high-speed differential signals M Kim IEEE Transactions on Electromagnetic Compatibility 58 (2), 619-622, 2016 | 17 | 2016 |
| Vertical inductive bridge EBG (VIB-EBG) structure with size reduction and stopband enhancement for wideband SSN suppression M Kim, K Koo, J Kim, J Kim IEEE microwave and wireless components letters 22 (8), 403-405, 2012 | 17 | 2012 |
| An on-chip electromagnetic bandgap structure using an on-chip inductor and a MOS capacitor C Hwang, Y Shim, K Koo, M Kim, JS Pak, J Kim IEEE microwave and wireless components letters 21 (8), 439-441, 2011 | 16 | 2011 |
| Vertical noise coupling from on-chip switching-mode power supply in a mixed-signal stacked 3-D-IC K Koo, M Kim, JJ Kim, J Kim, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (3 …, 2013 | 13 | 2013 |
| Application of VSI‐EBG structure to high‐speed differential signals for wideband suppression of common‐mode noise M Kim, S Kim, B Bae, J Cho, J Kim, J Kim, DS Ahn ETRI Journal 35 (5), 827-837, 2013 | 12 | 2013 |
| A miniaturized electromagnetic bandgap structure using an inductance-enhanced patch for suppression of parallel plate modes in packages and PCBs M Kim Electronics 7 (5), 76, 2018 | 8 | 2018 |
| On-chip magnetic resonant coupling with multi-stacked inductive coils for chip-to-chip wireless power transfer (WPT) S Kim, M Kim, S Kong, JJ Kim, J Kim 2012 IEEE International Symposium on Electromagnetic Compatibility, 34-38, 2012 | 8 | 2012 |
| Channel design for wide system bandwidth in a TSV based 3D IC H Kim, J Cho, J Kim, M Kim, J Lee, H Lee, K Park, J Kim, JS Pak 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI), 57-60, 2011 | 7 | 2011 |
| System-on-package ultra wideband transmitter with integrated bandpass filter and broad band planar antenna M Kim, J Lee, J Kim, YJ Park Proceedings Electronic Components and Technology, 2005. ECTC'05., 541-544, 2005 | 7 | 2005 |
| A compact and multi-stack electromagnetic bandgap structure for gigahertz noise suppression in multilayer printed circuit boards M Kim, S Ahn Applied Sciences 7 (8), 804, 2017 | 6 | 2017 |
| Small-size low-cost wideband continuous-time linear passive equalizer with an embedded cavity structure on a high-speed digital channel M Shin, M Kim, J Kim, J Kim, S Ahn IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (1 …, 2013 | 6 | 2013 |
Joungho KimProfessor of Electrical Engineering KAISTVerified email at kaist.ac.kr
