| Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards J Kim, MD Rotaru, S Baek, J Park, MK Iyer, J Kim IEEE Transactions on Electromagnetic Compatibility 48 (2), 319-330, 2006 | 72 | 2006 |
| Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection N Kim, M Sung, H Kim, S Baek, W Ryu, JG An, J Kim IEEE transactions on advanced packaging 24 (3), 260-267, 2001 | 30 | 2001 |
| Accurate high frequency lossy model of differential signal line including mode-conversion and common-mode propagation effect S Baek, S Ahn, J Park, J Kim, J Kim, J Cho 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No …, 2004 | 18 | 2004 |
| Noise coupling to signal trace and via from power/ground simultaneous switching noise in high speed double data rates memory module J Park, H Kim, JS Pak, Y Jeong, S Baek, J Kim, JJ Lee, JJ Lee 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No …, 2004 | 16 | 2004 |
| Computation of intra-pair skew for imbalance differential line using modified mixed-mode S-parameter S Baek, E Lee, B Sung 2007 IEEE Electrical Performance of Electronic Packaging, 179-182, 2007 | 15 | 2007 |
| Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board S Baek, DG Kam, B Park, J Kim, JG Byun, CS Choi 2002 IEEE International Symposium on Electromagnetic Compatibility 1, 200-204, 2002 | 14 | 2002 |
| Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB DG Kam, H Lee, S Baek, B Park, J Kim 2002 IEEE International Symposium on Electromagnetic Compatibility 2, 643-647, 2002 | 14 | 2002 |
| A novel twisted differential line for high-speed on-chip interconnections with reduced crosstalk DG Kam, S Ahn, S Baek, B Park, M Sung, J Kim 4th Electronics Packaging Technology Conference, 2002., 180-183, 2002 | 13 | 2002 |
| Storage characteristics and retrogradation properties of Sulgidduk added with almond powder SY Baek, CU Choi, MR Kim Korean Society of Food Science and Nutrition 47 (6), 638-648, 2018 | 12 | 2018 |
| GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises DG Kam, H Lee, S Baek, B Park, J Kim 52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002 | 12 | 2002 |
| Measurement and correlation-based methodology for estimating worst-case skew due to glass weave effect K Nalla, A Koul, S Baek, M Sapozhnikov, G Maghlakelidze, J Fan 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017 | 10 | 2017 |
| Behavioral model of switching DC-DC converter for improving power delivery network design S Baek, P Pun, A Agrawal 2012 IEEE 62nd Electronic Components and Technology Conference, 926-929, 2012 | 10 | 2012 |
| Diagnosis of dental cavity and osteoporosis using terahertz transmission images J Ryu, Y Jung, S Baek, J Lee, S Kim, J Kim, S Kwon International Conference on Ultrafast Phenomena, MF27, 2000 | 6 | 2000 |
| Compensation of ESD and device input capacitance by using embedded inductor on PCB substrate for 3 gbps serdes applications S Ahn, S Baek, J Lee, J Kim 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No …, 2004 | 5 | 2004 |
| Pulse-coupling measurement of coupled microstrip lines using a micromachined picosecond optical near-field probe J Lee, H Lee, S Baek, YC Jeong, J Kim IEEE Transactions on Microwave Theory and Techniques 49 (10), 1740-1746, 2001 | 5 | 2001 |
| Efficient data encoding WP Cornelius, S Baek US Patent 10,812,102, 2020 | 4 | 2020 |
| 10 Gbps backplane design methodology with sensitivity analysis and statistical analysis J Kim, S Baek, H Park, S Kim, Y Hong, D Lim, J Kim 2005 7th Electronic Packaging Technology Conference 1, 5 pp., 2005 | 2 | 2005 |
| Modeling and measurement of mode-conversion and frequency dependent loss in high-speed differential interconnections on multilayer PCB S Baek, J Kim, J Kim IEICE transactions on electronics 88 (10), 1992-2000, 2005 | 2 | 2005 |
| Open load backward matching (OLBM) technique for low ISI differential H-tree clock and data transmission D Chung, S Baek, J Kim Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710), 269-272, 2003 | 2 | 2003 |
| Design and estimation of embedded passives in multiple line grid array (MLGA) package J Lee, S Ahn, S Baek, J Kim, YS Kim, CK Yoon International Symposium on Electronic Materials and Packaging (EMAP2000)(Cat …, 2000 | 2 | 2000 |
