| Thermal interface materials for cooling microelectronic systems: present status and future challenges. KNP Ramakrishna Devananda P. Journal of Materials Science: Materials in Electronics, 2021 | 24 | 2021 |
| Tribological Wear Behavior of AISI 630 (17-4 PH) Stainless Steel Hardened by Precipitation Hardening SKM Mahesha N. S., Hanumantharaya R., Mahesh B. Davanageri, Ramakrishna ... American Journal of Materials Science 6 (4A), 6-14, 2016 | 15* | 2016 |
| The effect of load and addition of MWCNTs on silicone based TIMs on thermal contact heat transfer across Cu/Cu interface K NarayanPrabhu Materials Research Express 6 (11), 1165h9, 2019 | 8 | 2019 |
| Analysis of Thrust Force and Torque in Drilling Granite particulate Reinforced Epoxy Composites by using Multi Facet HSS Twist Drill NL Vaishak, R Devananda, JD Quadros, R Shetty, SS Balakrishna Proceedings of 8th International Conference on Engineering and Technology …, 2014 | 3 | 2014 |
| Determination of cooling performance of nanofluids for use in transformers by an instrumented copper Probe R Devananda, KN Prabhu Journal of Nanofluids 3 (1), 38-43, 2014 | 1 | 2014 |
K. NARAYAN PRABHUProfessor, Department of Metallurgical and Materials Engineering, NITKVerified email at nitk.edu.in
