| CoMeT: An integrated interval thermal simulation toolchain for 2D, 2.5 D, and 3D processor-memory systems L Siddhu, R Kedia, S Pandey, M Rapp, A Pathania, J Henkel, PR Panda ACM Transactions on Architecture and Code Optimization (TACO) 19 (3), 1-25, 2022 | 17 | 2022 |
| Design Space Exploration of FPGA-Based System With Multiple DNN Accelerators R Kedia, S Goel, M Balakrishnan, K Paul, R Sen IEEE Embedded Systems Letters 13 (3), 114-117, 2020 | 17 | 2020 |
| INFER: INterFerence-aware Estimation of Runtime for Concurrent CNN Execution on DPUs S Goel, R Kedia, M Balakrishnan, R Sen 2020 International Conference on Field-Programmable Technology (ICFPT), 66-71, 2020 | 12 | 2020 |
| MAVI: Mobility Assistant for Visually Impaired with Optional Use of Local and Cloud Resources R Kedia, A Sobti, M Rungta, S Chandoliya, A Soni, AK Meena, CM Lobo, ... 2019 32nd International Conference on VLSI Design and 2019 18th …, 2019 | 12 | 2019 |
| MAVI: An embedded device to assist mobility of visually impaired R Kedia, KK Yoosuf, P Dedeepya, M Fazal, C Arora, M Balakrishnan 2017 30th International Conference on VLSI Design and 2017 16th …, 2017 | 10 | 2017 |
| Leakage-Aware Dynamic Thermal Management of 3D Memories L Siddhu, R Kedia, PR Panda ACM Transactions on Design Automation of Electronic Systems (TODAES) 26 (2 …, 2020 | 9 | 2020 |
| FN-CACTI: Advanced CACTI for FinFET and NC-FinFET Technologies DP Ravipati, R Kedia, VM Van Santen, J Henkel, PR Panda, H Amrouch IEEE Transactions on Very Large Scale Integration (VLSI) Systems 30 (3), 339-352, 2021 | 8 | 2021 |
| CoreMemDTM: Integrated Processor Core and 3D Memory Dynamic Thermal Management for Improved Performance L Siddhu, R Kedia, PR Panda 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2022 | 5 | 2022 |
| EXPRESS: CNN EXecution Time PREdiction for DPU DeSign Space Exploration S Goel, R Kedia, R Sen, M Balakrishnan 2022 International Conference on Field-Programmable Technology (ICFPT), 1-2, 2022 | 1 | 2022 |
| Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure L Siddhu, A Bagchi, R Kedia, I Ahmad, S Pandey, PR Panda ACM Transactions on Embedded Computing Systems 22 (6), 1-27, 2023 | | 2023 |
| CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5 D, and 3D Processor-Memory Systems R Kedia ASSOC COMPUTING MACHINERY, 2022 | | 2022 |
| A framework for designing context-aware adaptive embedded systems R Kedia IIT Delhi, 2020 | | 2020 |
| A case for design space exploration of context-aware adaptive embedded systems: work-in-progress R Kedia, M Balakrishnan, K Paul Proceedings of the International Conference on Hardware/Software Codesign …, 2019 | | 2019 |
| GRanDE: Graphical Representation and Design Space Exploration of Embedded Systems R Kedia, M Balakrishnan, K Paul 2019 22nd Euromicro Conference on Digital System Design (DSD), 4-12, 2019 | | 2019 |
| A framework for designing context aware adaptive embedding system R Kedia Delhi, 0 | | |
M BalakrishnanCSE Department IIT DelhiVerified email at cse.iitd.ac.in
