| Design issues and considerations for low-cost 3-D TSV IC technology G Van der Plas, P Limaye, I Loi, A Mercha, H Oprins, C Torregiani, S Thijs, ... Solid-State Circuits, IEEE Journal of 46 (1), 293-307, 2011 | 388 | 2011 |
| Cu/Sn microbumps interconnect for 3D TSV chip stacking R Agarwal, W Zhang, P Limaye, R Labie, B Dimcic, A Phommahaxay, ... 2010 Proceedings 60th electronic components and technology conference (ECTC …, 2010 | 112 | 2010 |
| High density Cu-Sn TLP bonding for 3D integration R Agarwal, W Zhang, P Limaye, W Ruythooren 2009 59th electronic components and technology conference, 345-349, 2009 | 51 | 2009 |
| Fabrication of vertical mirrors using plasma etch and KOH: IPA polishing R Agarwal, S Samson, S Bhansali Journal of Micromechanics and Microengineering 17 (1), 26, 2006 | 46 | 2006 |
| 3D packaging for heterogeneous integration R Agarwal, P Cheng, P Shah, B Wilkerson, R Swaminathan, J Wuu, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1103-1107, 2022 | 38 | 2022 |
| 3D V-Cache: the Implementation of a Hybrid-Bonded 64MB Stacked Cache for a 7nm x86-64 CPU J Wuu, R Agarwal, M Ciraula, C Dietz, B Johnson, D Johnson, ... 2022 IEEE International Solid-State Circuits Conference (ISSCC) 65, 428-429, 2022 | 34 | 2022 |
| Insertion bonding: A novel Cu-Cu bonding approach for 3D integration C Okoro, R Agarwal, P Limaye, B Vandevelde, D Vandepitte, E Beyne 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 32 | 2010 |
| Molded chip combination MS Bhagavat, L Fu, I Barber, CK Leong, R Agarwal US Patent 10,510,721, 2019 | 27 | 2019 |
| Die stacking using 3D-wafer level packaging copper/polymer through-Si via technology and Cu/Sn interconnect bumping Y Civale, DS Tezcan, HGG Philipsen, P Jaenen, R Agarwal, F Duval, ... 2009 IEEE International Conference on 3D System Integration, 1-4, 2009 | 27 | 2009 |
| Die stacking for multi-tier 3D integration R Agarwal, MS Bhagavat US Patent 10,727,204, 2020 | 26 | 2020 |
| Fabrication of integrated vertical mirror surfaces and transparent window for packaging MEMS devices R Agarwal, S Samson, S Kedia, S Bhansali Journal of Microelectromechanical systems 16 (1), 122-129, 2007 | 26 | 2007 |
| Device performance analysis on 20nm technology thin wafers in a 3D package S Kannan, R Agarwal, A Bousquet, G Aluri, HS Chang 2015 IEEE International Reliability Physics Symposium, 4C. 4.1-4C. 4.5, 2015 | 20 | 2015 |
| Enhancing rankings of search results for member profile queries R Agarwal, S Sundaram US Patent 10,042,940, 2018 | 19 | 2018 |
| Chip-package interaction: Challenges and solutions to mechanical stability of Back end of Line at 28nm node and beyond for advanced flip chip application F Kuechenmeister, D Breuer, H Geisler, J Paul, C Shah, KV Machani, ... 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 430-436, 2012 | 18 | 2012 |
| A three-axis SOI accelerometer sensing with both in-plane and vertical comb electrodes J Xie, R Agarwal, Y Liu, JM Tsai Microsystem technologies 18, 325-332, 2012 | 18 | 2012 |
| Enabling 10µm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias C Huyghebaert, J Van Olmen, O Chukwudi, J Coenen, A Jourdain, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 18 | 2010 |
| Fabrication processes for packaged optical MEMS devices S Samson, R Agarwal, S Kedia, W Wang, S Onishi, J Bumgarner 2005 International Conference on MEMS, NANO and Smart Systems, 113-118, 2005 | 17 | 2005 |
| Compact electrode design for an in-plane accelerometer on SOI with refilled isolation trench J Xie, R Agarwal, Y Liu, JM Tsai, N Ranganathan, J Singh Journal of Micromechanics and Microengineering 21, 095005, 2011 | 16 | 2011 |
| Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack-Challenges and solutions G Van der Plas, S Thijs, D Linten, G Katti, P Limaye, A Mercha, M Stucchi, ... IEEE Custom Integrated Circuits Conference 2010, 1-4, 2010 | 16 | 2010 |
| Comparison of microchannel dimensions for air-breathing polymer exchange membrane microfuel cells CS Spiegel, R Agarwal, S Bhansali Journal of power sources 182 (2), 603-608, 2008 | 16 | 2008 |
Paresh LimayeAmkor TechnologyVerified email at amkor.com
