| An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates K Sakuma, K Tunga, B Webb, K Ramachandran, M Interrante, H Liu, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 318-324, 2015 | 37 | 2015 |
| Differential heating/cooling chip joining method to prevent chip package interaction issue in large die with ultra low-k technology K Sakuma, K Smith, K Tunga, E Perfecto, T Wassick, F Pompeo, JW Nah 2012 IEEE 62nd Electronic Components and Technology Conference, 430-435, 2012 | 26 | 2012 |
| Accelerated thermal cycling: Is it different for lead-free solder? K Tunga, K Kacker, RV Pucha, SK Sitaraman 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 23 | 2004 |
| Predictive model development for life prediction of PBGA packages with SnAgCu solder joints K Tunga, SK Sitaraman IEEE Transactions on Components and Packaging Technologies 33 (1), 84-97, 2009 | 21 | 2009 |
| Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry KR Tunga Georgia Institute of Technology, 2008 | 16 | 2008 |
| An expedient experimental technique for the determination of thermal cycling fatigue life for BGA package solder balls K Tunga, SK Sitaraman | 16 | 2007 |
| Accelerated thermal cycling guidelines for electronic packages in military avionics thermal environment RV Pucha, K Tunga, J Pyland, SK Sitaraman J. Electron. Packag. 126 (2), 256-264, 2004 | 13 | 2004 |
| Experimental and theoretical assessment of PBGA reliability in conjunction with field-use conditions KR Tunga | 10 | 2004 |
| Geometric optimization and mechanical risk mmitigation in 2.5 D flip-chip packages using parametric finite element analysis (FEA) simulations T Sinha, S Li, K Tunga, JA Zitz, KK Sikka 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 8 | 2016 |
| Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates K Sakuma, E Blackshear, K Tunga, C Lian, S Li, M Interrante, O Mantilla, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 667-673, 2013 | 8 | 2013 |
| System-level reliability assessment of mixed-signal convergent microsystems RV Pucha, S Hegde, M Damani, K Tunga, A Perkins, S Mahalingam, ... IEEE transactions on advanced packaging 27 (2), 438-452, 2004 | 8 | 2004 |
| Study on the choice of constitutive and fatigue models in solder joint life prediction K Tunga, J Pyland, RV Pucha, SK Sitaraman ASME International Mechanical Engineering Congress and Exposition 36487, 329-335, 2002 | 8 | 2002 |
| Multichip electronic packages and methods of manufacture KK Sikka, HT Toy, KR Tunga, JA Zitz US Patent 8,592,970, 2013 | 7 | 2013 |
| Language learning and speech enhancement through natural language processing M Amin, Z Bi, LA Clevenger, LAH Clevenger, CJ Penny, KR Tunga, ... US Patent 10,916,154, 2021 | 6 | 2021 |
| Fatigue life predictive model and acceleration factor development for decoupling capacitors K Tunga, J Ross, K Sikka, T Lombardi, B Parikh, E Turcotte, C Dufort, ... 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 6 | 2018 |
| Novel design and integration enhancements in the final polymeric passivation for improved mechanical performance and C4 electromigration in lead-free C4 products E Misra, T Daubenspeck, T Wassick, GJ Scott, K Tunga, G Lafontant, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 571-576, 2012 | 6 | 2012 |
| COACH: Cognitive analytics for change S Güven, P Jasionowski, K Murthy, K Tunga, G Stark 2017 IFIP/IEEE Symposium on Integrated Network and Service Management (IM …, 2017 | 5 | 2017 |
| Electronic package with tapered pedestal KK Sikka, HT Toy, KR Tunga, T Weiss US Patent 10,424,527, 2019 | 4 | 2019 |
| Optimized individual sleep patterns M Amin, Z Bi, LA Clevenger, LAH Clevenger, KR Tunga US Patent 10,420,502, 2019 | 4 | 2019 |
| Role of FBEOL Al pads and hard dielectric for improved mechanical performance in lead-free C4 products E Misra, T Daubenspeck, T Wassick, K Tunga, D Questad, G Osborne, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 2208-2213, 2013 | 4 | 2013 |
Ekta MisraIBMVerified email at us.ibm.com
