| FDTD technique based crosstalk analysis of bundled SWCNT interconnects YS Duksh, BK Kaushik, RP Agarwal Journal of Semiconductors 36 (5), 055002, 2015 | 23 | 2015 |
| Analysis of propagation delay and power with variation in driver size and number of shells in multi walled carbon nanotube interconnects YS Duksh, BK Kaushik, S Sarkar, R Singh Journal of engineering, design and technology 11 (1), 19-33, 2013 | 14 | 2013 |
| Performance comparison of carbon nanotube, nickel silicide nanowire and copper VLSI interconnects: Perspectives and challenges ahead Y Singh Duksh, BK Kaushik, S Sarkar, R Singh Journal of Engineering, Design and Technology 8 (3), 334-353, 2010 | 10 | 2010 |
| Effect of driver size and number of shells on propagation delay in MWCNT interconnects YS Duksh, BK Kaushik, S Sarkar, R Singh 2011 International Conference on Devices and Communications (ICDeCom), 1-5, 2011 | 8 | 2011 |
| Subthreshold modeling of graded channel double gate junctionless FETs YS Duksh, B Singh, D Gola, PK Tiwari, S Jit Silicon 13 (4), 1231-1238, 2021 | 6 | 2021 |
| Self-heating and negative differential conductance improvement by substrate bias voltage in tri-gate junctionless transistor D Gola, YS Duksh, B Singh, PK Tiwari Silicon 14 (5), 2219-2224, 2022 | 3 | 2022 |
| Delay and Power Analysis of Bundled SWCNT Interconnects with Variation in Driver Size YS Duksh International Journal of Research in Electronics and Computer Engineering …, 2018 | | 2018 |
