| Enhancement of bonding strength in BiTe-based thermoelectric modules by electroless nickel, electroless palladium, and immersion gold surface modification YN Nguyen, S Kim, SH Bae, I Son Applied Surface Science 545, 149005, 2021 | 16 | 2021 |
| Diffusion bonding at the interface of Bi2Te3 thermoelectric modules YN Nguyen, I Son Materials Chemistry and Physics 292, 126813, 2022 | 12 | 2022 |
| Performance of Bi2Te3-based thermoelectric modules tailored by diffusion barriers YN Nguyen, KT Kim, SH Chung, I Son Journal of Alloys and Compounds 895, 162716, 2022 | 12 | 2022 |
| Enhanced output power of thermoelectric modules with reduced contact resistance by adopting the optimized Ni diffusion barrier layer JM Park, DY Hyeon, HS Ma, S Kim, ST Kim, YN Nguyen, I Son, S Yi, ... Journal of Alloys and Compounds 884, 161119, 2021 | 12 | 2021 |
| Thermomechanical stability of Bi2Te3-based thermoelectric modules employing variant diffusion barriers YN Nguyen, I Son Intermetallics 140, 107404, 2022 | 7 | 2022 |
| Ni–W–P layer-induced strength improvement of solder joint in Bi2Te3 thermoelectric module SH Bae, YN Nguyen, I Son Science and Technology of Welding and Joining 28 (5), 399-406, 2023 | 5 | 2023 |
| Densification and mechanical properties of FeMn13-TiC composites fabricated by pulsed electric current sintering process KQ Dang, YN Nguyen, QA Hoang, H Van Tran, MC Nguyen, H Van Pham, ... Acta Metallurgica Slovaca 24 (4), 273-279, 2018 | 4 | 2018 |
| Bulk Bi2Te3-based bendable thermoelectric device with highly elastic Cu-Be alloy foils YN Nguyen*, J Park*, SH Bae, D Kim, KQ Dang, I Son Materials Today Communications 34, 105408, 2023 | 3 | 2023 |
| FABRICATION OF TRANSPARENT MgAl2O4 SPINEL CERAMICS BY PECS PROCESSING OF COMBUSTION-SYTHESIZED NANOPOWDERS YN Nguyen, TA Dao, HM Le, KQ Dang, M Nanko Acta Metallurgica Slovaca 25 (3), 186-192, 2019 | 3 | 2019 |
| Electrodeposition of Pd–Ag alloy for electrical contacts YN Nguyen, J Yoon, J Shin, I Son Surface Engineering 38 (6), 633-640, 2022 | 2 | 2022 |
| Novel silver-enhanced hard gold electrodeposit applied for electrical contacts: comparison with conventional gold–cobalt alloy YN Nguyen, J Lee, I Son Transactions of the IMF 100 (4), 213-220, 2022 | 1 | 2022 |
| Effect of the Electroless Nickel, Electroless Palladium, and Immersion Gold Multilayer as a Diffusion Barrier on the Bonding Strength of BiTe-Based Thermoelectric Modules YN Nguyen, KQ Dang, I Son Journal of Nanoscience and Nanotechnology 21 (8), 4498-4502, 2021 | 1 | 2021 |
| Thermal Stability of Electroless NiP Diffusion Barrier on BiTe-Based Thermoelectric Materials Y Ngoc Nguyen, K Quoc Dang, I Son Journal of Nanoelectronics and Optoelectronics 16 (5), 812-818, 2021 | 1 | 2021 |
| RESEARCH PAPER PREPARATION OF TRANSPARENT MgAl2O4 CERAMICS BY PULSED ELEC-TRIC CURRENT SINTERING USING TWO-STEP HEATING METHOD YN Nguyen, HM Le, TA Dao, HN Tran, TN Nguyen, TH Le, KQ Dang ACTA METALLURGICA SLOVACA 27 (4), 203-206, 2021 | 1 | 2021 |
| Minimizing gold amount by alloying silver in hard gold YN Nguyen, C Nguyen, AK Tieu, I Son Sustainable Materials and Technologies, e00849, 2024 | | 2024 |
| Consolidation of alumina toughened zirconia by two-step sintering KQ Dang, YN Nguyen, HL Vu Processing and Application of Ceramics 17 (2), 164-171, 2023 | | 2023 |
| PREPARATION OF Cu MATRIX COMPOSITE REINFORCED WITH IN-SITU NANOSIZED Al2O3 PARTICLE POWDER FROM METAL NITRATES HM Le, YN Nguyen, DTH Truong, HD Vu, HH Nguyen, KQ Dang Acta Metallurgica Slovaca 25 (1), 41-47, 2019 | | 2019 |
