| Pattern weakness and strength detection and tracking during a semiconductor device fabrication process K Zafar, C Hu, Y Chen, Y Ma, C Hsiang, J Chen, R Xu, A Vikram, P Zhang US Patent 9,846,934, 2017 | 45 | 2017 |
| Pattern centric process control C Hu, K Zafar, Y Chen, Y Ma, R Lv, J Chen, A Vikram, Y Xu, P Zhang US Patent App. 15/944,080, 2018 | 30 | 2018 |
| OPC verification and hotspot management for yield enhancement through layout analysis G Yoo, J Kim, T Lee, A Jung, H Yang, D Yim, S Park, K Maruyama, ... Metrology, Inspection, and Process Control for Microlithography XXV 7971 …, 2011 | 19 | 2011 |
| Hot spot management through design based metrology: measurement and filtering T Lee, H Yang, J Kim, A Jung, G Yoo, D Yim, S Park, A Ishikawa, ... Lithography Asia 2009 7520, 567-577, 2009 | 17 | 2009 |
| Simulation based mask defect repair verification and disposition E Guo, S Zhao, S Qian, G Cheng, A Vikram, L Li, Y Chen, C Hsiang, ... Photomask Technology 2009 7488, 141-150, 2009 | 15 | 2009 |
| Yield impacting systematic defects search and management J Zhang, Q Xu, X Zhang, X Zhao, J Ning, G Cheng, S Chen, G Zhang, ... Design for Manufacturability through Design-Process Integration VI 8327, 333-339, 2012 | 14 | 2012 |
| Critical defect detection, monitoring and fix through process integration engineering by using D2DB pattern monitor solution M Tian, Y Zhang, T Guan, J Leng, B Zhao, L Yan, W Hua, A Vikram, ... Design-Process-Technology Co-optimization for Manufacturability XIII 10962 …, 2019 | 10 | 2019 |
| Janay Camp, Sumanth Kini, Frank Jin, Vinod Venkatesan,“Inspection of highaspect ratio layers at sub 20nm node”, Metrology, Inspection, and Process Control for Microlithography … A Vikram, K Lin Proc. of SPIE 8681, 2013 | 10* | 2013 |
| Inspection of high-aspect ratio layers at sub 20nm node A Vikram, K Lin, J Camp, S Kini, F Jin, V Venkatesan Metrology, Inspection, and Process Control for Microlithography XXVII 8681 …, 2013 | 9 | 2013 |
| Novel pattern-centric solution for high performance 3D NAND VIA dishing metrology S Wang, J Mi, A Vikram, G Xu, G Cheng, L Zhang, P Liu Design-Process-Technology Co-optimization for Manufacturability XIII 10962 …, 2019 | 8 | 2019 |
| Detection of OPC conflict edges through MEEF analysis LF Chang, CI Choi, G Cheng, A Vikram, G Zhang, B Su Design for Manufacturability through Design-Process Integration IV 7641, 299-306, 2010 | 6 | 2010 |
| Pattern centric process control C Hu, K Zafar, Y Chen, Y Ma, R Lv, J Chen, A Vikram, Y Xu, P Zhang US Patent 10,997,340, 2021 | 5 | 2021 |
| An advanced and efficient methodology for process setup and monitoring by using process stability diagnosis in computational lithography L Chen, J Zhu, X Fan, H Zheng, X Wang, Y Ge, Y Zhang, A Vikram, ... Design-Process-Technology Co-optimization for Manufacturability XIV 11328 …, 2020 | 5 | 2020 |
| Pattern weakness and strength detection and tracking during a semiconductor device fabrication process K Zafar, C Hu, Y Chen, Y Ma, C Hsiang, J Chen, R Xu, A Vikram, P Zhang US Patent 10,062,160, 2018 | 5 | 2018 |
| Pattern-Centric Computational System for Logic and Memory Manufacturing and Process Technology Development C Hu, K Zafar, A Vikram, G Ying Journal of Microelectronics Manufacturing 3 (4), 20030410, 2020 | 4 | 2020 |
| Lithography technology for advanced devices and introduction to integrated CAD analysis for hotspot detection A Vikram, V Agarwal, A Agarwal IET Circuits, Devices & Systems 11 (1), 1-9, 2017 | 4 | 2017 |
| Applying reconfigurable RET across process window to create more robust manufacturing designs M Laurance, A Vikram, M Ma, W Volk, M Anderson, S Andrews, B Su, ... 25th Annual BACUS Symposium on Photomask Technology 5992, 623-632, 2005 | 4 | 2005 |
| Pattern-centric yield management approach with machine learning to detect and track defects with full chip coverage Y Zhang, S Yu, J Liu, R Meng, L Yin, K Wang, K Cai, X Zhang, X Song, ... Design-Process-Technology Co-optimization XV 11614, 18-25, 2021 | 2 | 2021 |
| Design and Development of Experimental Based Phase Modulated Model Predictive Control for Torque Ripple Reduction of MMC Fed BLDC Motor R Jaiswal, A Agarwal, R Negi, A Vikram Journal of Engg. Research EMSME Special Issue pp 70, 78, 2021 | 2 | 2021 |
| Improved Efficiency and Voltage Gain Conversion Ratio using Inductor Model based modified Dickson Charge Pump G Prabhakar, RK Singh, A Vikram Journal of Engineering Science and Technology Review 11 (4), 1-7, 2018 | 2 | 2018 |
