| Ultra‐Long Lifetimes of Single Quantum Emitters in Monolayer WSe2/hBN Heterostructures CK Dass, MA Khan, G Clark, JA Simon, R Gibson, S Mou, X Xu, ... Advanced Quantum Technologies 2 (5-6), 1900022, 2019 | 18 | 2019 |
| Investigation of carrier localization in InAs/AlSb type-II superlattice material system S Lee, HJ Jo, S Mathews, JA Simon, TJ Ronningen, SH Kodati, DR Fink, ... Applied Physics Letters 115 (21), 2019 | 14 | 2019 |
| Functional magnetic resonance imaging-based brain computer interfaces J Simon, P Fishbein, L Zhu, M Roberts, I Martin Neural Interface Engineering: Linking the Physical World and the Nervous …, 2020 | 6 | 2020 |
| Coherent Random Lasing in Subwavelength Quasi‐2D Perovskites C Fruhling, K Wang, S Chowdhury, X Xu, J Simon, A Kildishev, L Dou, ... Laser & Photonics Reviews 17 (4), 2200314, 2023 | 3 | 2023 |
| Wide‐Range Angle‐Sensitive Plasmonic Color Printing on Lossy‐Resonator Substrates SN Chowdhury, J Simon, MP Nowak, K Pagadala, P Nyga, C Fruhling, ... Advanced Optical Materials 12 (4), 2301678, 2024 | 2 | 2024 |
| MXenes for Optics and Photonics J Simon, C Fruhling, H Kim, Y Gogotsi, A Boltasseva Optics and Photonics News 34 (11), 42-49, 2023 | 1 | 2023 |
| TECHNOLOGIES FOR VERIFYING AND VALIDATING ELECTRONIC DEVICES USING ELECTROLUMINESCENCE R Gilabert, T Kent, KT Liszewski, C Meadows, JA Simon US Patent App. 18/068,557, 2023 | 1 | 2023 |
| Two-Photon Optical Beam Induced Current for Circuit Level Verification and Validation of a 130 nm Microelectronic Device J Simon, N Mun, A George, J Baur, J Busch, C Meadows, K Liszewski, ... 2021 IEEE Physical Assurance and Inspection of Electronics (PAINE), 1-7, 2021 | 1 | 2021 |
| Modeling of 6.1 Å Family Strained-Layer Superlattice Structures J Simon The Ohio State University, 2019 | 1 | 2019 |
| Theory-guided synthesis of a 2D tungsten titanium MXene from a covalently bonded layered carbide for electrocatalysis A Thakur, W Highland, B Wyatt, J Xu, N Chandran, B Zhang, Z Hood, ... | | 2024 |
| Systems and methods for precise signal injection into microelectronic devices TF Kent, JA Simon US Patent 11,899,060, 2024 | | 2024 |
| NON-DESTRUCTIVE VERIFICATION OF INTEGRATED CIRCUITS TF Kent, AG Kimura, KT Liszewski, AF George, JA Simon, BP Dupaix US Patent App. 18/198,530, 2023 | | 2023 |
| Wide-range Angle-sensitive Plasmonic Color Printing with a Lossy Resonator SN Chowdhury, J Simon, MP Nowak, LJ Prokopeva, K Pagadala, ... CLEO: Applications and Technology, ATu3R. 4, 2023 | | 2023 |
| HIGH RESOLUTION IMAGING OF MICROELECTRONIC DEVICES TF Kent, JA Simon US Patent App. 17/830,517, 2022 | | 2022 |
