| Power and performance analysis of 3D network-on-chip architectures B Halavar, B Talawar Computers & Electrical Engineering 83, 106592, 2020 | 11 | 2020 |
| Extending BookSim2. 0 and HotSpot6. 0 for power, performance and thermal evaluation of 3D NoC architectures B Halavar, U Pasupulety, B Talawar Simulation Modelling Practice and Theory 96, 101929, 2019 | 7 | 2019 |
| Accurate performance analysis of 3d mesh network on chip architectures B Halavar, B Talawar 2018 IEEE International Conference on Electronics, Computing and …, 2018 | 6 | 2018 |
| Accurate power and latency analysis of a through-silicon Via (TSV) U Pasupulety, B Halavar, B Talawar 2018 International Conference on Advances in Computing, Communications and …, 2018 | 3 | 2018 |
| Optical Switching for High‐Performance Computing R Prasath, B Halavar, O Vanga Optical Switching: Device Technology and Applications in Networks, 335-346, 2022 | 1 | 2022 |
| Thermal Aware Design for Through-Silicon Via (TSV) based 3D Network-on-Chip (NoC) Architectures U Pasupulety, B Halavar, B Talawar 2018 8th International Symposium on Embedded Computing and System Design …, 2018 | 1 | 2018 |
| OP3DBFT: A power and performance optimal 3D BFT NoC architecture B Halavar, B Talawar International Conference on Intelligent Systems Design and Applications, 923-933, 2018 | 1 | 2018 |
| Floorplan based performance evaluation of 3d variants of mesh and BFT networks-on-chip B Halavar, B Talawar 2018 International Conference on Signal Processing and Communications (SPCOM …, 2018 | 1 | 2018 |
| Design of Power and Performance Optimal 3D-NoC Architectures B Halavar National Institute of Technology Karnataka, Surathkal, 2020 | | 2020 |
