| High-efficiency PCB-and package-level wireless power transfer interconnection scheme using magnetic field resonance coupling S Kim, DH Jung, JJ Kim, B Bae, S Kong, S Ahn, J Kim, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (7 …, 2015 | 36 | 2015 |
| Design, implementation and measurement of board-to-board wireless power transfer (WPT) for low voltage applications S Kim, B Bae, S Kong, DH Jung, JJ Kim, J Kim 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging …, 2013 | 18 | 2013 |
| Electromagnetic interference shielding effects in wireless power transfer using magnetic resonance coupling for board-to-board level interconnection S Kim, H Kim, JJ Kim, B Bae, S Kong, J Kim 2013 IEEE International Symposium on Electromagnetic Compatibility, 773-778, 2013 | 16 | 2013 |
| Modeling of electromagnetic interference shielding materials in wireless power transfer for board-to-board level interconnections S Kim, DH Jung, JJ Kim, B Bae, S Kong, C Song, J Kim 2014 IEEE Wireless Power Transfer Conference, 273-276, 2014 | 10 | 2014 |
| On-chip magnetic resonant coupling with multi-stacked inductive coils for chip-to-chip wireless power transfer (WPT) S Kim, M Kim, S Kong, JJ Kim, J Kim 2012 IEEE International Symposium on Electromagnetic Compatibility, 34-38, 2012 | 8 | 2012 |
| Technology Scaling of ESD Devices in State of the Art FinFET Technologies S Kim, R Sithanandam, W Seo, M Lee, S Cho, J Park, H Kwon, N Kim, ... 2020 IEEE Custom Integrated Circuits Conference (CICC), 1-6, 2020 | 1 | 2020 |
| Electrostatic discharge (ESD) effects on wireless power transfer using magnetic resonance coupling S Kim, Y Cho, JJ Kim, B Bae, S Kong, J Kim 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014 | | 2014 |
