| Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing WB Lee, KS Bang, SB Jung Journal of Alloys and Compounds 390 (1-2), 212-219, 2005 | 406 | 2005 |
| The joint properties of copper by friction stir welding WB Lee, SB Jung Materials Letters 58 (6), 1041-1046, 2004 | 397 | 2004 |
| Interfacial reaction in steel–aluminum joints made by friction stir welding WB Lee, M Schmuecker, UA Mercardo, G Biallas, SB Jung Scripta Materialia 55 (4), 355-358, 2006 | 355 | 2006 |
| The improvement of mechanical properties of friction-stir-welded A356 Al alloy WB Lee, YM Yeon, SB Jung Materials Science and Engineering: A 355 (1-2), 154-159, 2003 | 303 | 2003 |
| Microstructural investigation of friction stir welded pure titanium WB Lee, CY Lee, WS Chang, YM Yeon, SB Jung Materials Letters 59 (26), 3315-3318, 2005 | 290 | 2005 |
| The joint properties of dissimilar formed Al alloys by friction stir welding according to the fixed location of materials WB Lee, YM Yeon, SB Jung Scripta materialia 49 (5), 423-428, 2003 | 257 | 2003 |
| Joint properties of friction stir welded AZ31B–H24 magnesium alloy WB Lee, YM Yeon, SB Jung Materials Science and Technology 19 (6), 785-790, 2003 | 184 | 2003 |
| Mechanical properties related to microstructural variation of 6061 Al alloy joints by friction stir welding WB Lee, YM Yeon, SB Jung Materials transactions 45 (5), 1700-1705, 2004 | 168 | 2004 |
| Dissimilar friction stir spot welding of low carbon steel and Al–Mg alloy by formation of IMCs CY Lee, DH Choi, YM Yeon, SB Jung Science and Technology of Welding and Joining 14 (3), 216-220, 2009 | 164 | 2009 |
| IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate JW Yoon, SW Kim, SB Jung Journal of Alloys and Compounds 392 (1-2), 247-252, 2005 | 163 | 2005 |
| Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate JW Yoon, YH Lee, DG Kim, HB Kang, SJ Suh, CW Yang, CB Lee, ... Journal of alloys and compounds 381 (1-2), 151-157, 2004 | 161 | 2004 |
| Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints JW Yoon, BI Noh, BK Kim, CC Shur, SB Jung Journal of alloys and compounds 486 (1-2), 142-147, 2009 | 154 | 2009 |
| Interfacial reaction and mechanical properties of eutectic Sn–0.7 Cu/Ni BGA solder joints during isothermal long-term aging JW Yoon, SW Kim, SB Jung Journal of Alloys and compounds 391 (1-2), 82-89, 2005 | 145 | 2005 |
| Formation of intermetallic compounds in Al and Mg alloy interface during friction stir spot welding DH Choi, BW Ahn, CY Lee, YM Yeon, K Song, SB Jung Intermetallics 19 (2), 125-130, 2011 | 138 | 2011 |
| Evaluation of the microstructure and mechanical properties of friction stir welded 6005 aluminum alloy WB Lee, YM Yeon, SB Jung Materials Science and Technology 19 (11), 1513-1518, 2003 | 130 | 2003 |
| Interfacial reactions and growth kinetics for intermetallic compound layer between In–48Sn solder and bare Cu substrate DG Kim, SB Jung Journal of alloys and compounds 386 (1-2), 151-156, 2005 | 124 | 2005 |
| Microstructures and wear property of friction stir welded AZ91 Mg/SiC particle reinforced composite WB Lee, CY Lee, MK Kim, JI Yoon, YJ Kim, YM Yoen, SB Jung Composites Science and Technology 66 (11-12), 1513-1520, 2006 | 122 | 2006 |
| The joint characteristics of friction stir welded AZ91D magnesium alloy WB Lee, JW Kim, YM Yeon, SB Jung Materials Transactions 44 (5), 917-923, 2003 | 117 | 2003 |
| Effect of isothermal aging on ball shear strength in BGA joints with Sn-3.5 Ag-0.75 Cu solder CB Lee, SB Jung, YE Shin, CC Shur Materials Transactions 43 (8), 1858-1863, 2002 | 116 | 2002 |
| Interdiffusion and its size effect in nickel solid solutions of Ni-Co, Ni-Cr and Ni-Ti systems SB Jung, T Yamane, Y Minamino, K Hirao, H Araki, S Saji Journal of materials science letters 11, 1333-1337, 1992 | 115 | 1992 |
Jong-Woong KimSungkyunkwan UniversityVerified email at skku.edu
