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Baik-Woo Lee
Baik-Woo Lee
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Year
An instrumented indentation technique for estimating fracture toughness of ductile materials: A critical indentation energy model based on continuum damage mechanics
JS Lee, J Jang, BW Lee, Y Choi, SG Lee, D Kwon
Acta materialia 54 (4), 1101-1109, 2006
1782006
Quantitative determination of contact depth during spherical indentation of metallic materials—A FEM study
SH Kim, BW Lee, Y Choi, D Kwon
Materials Science and Engineering: A 415 (1-2), 59-65, 2006
1392006
Embedded actives and discrete passives in a cavity within build-up layers
BW Lee, C Yoon, V Sundaram, R Tummala
US Patent 8,335,084, 2012
1322012
Effects of microstructural change on fracture characteristics in coarse-grained heat-affected zones of QLT-processed 9% Ni steel
J Jang, JB Ju, BW Lee, D Kwon, WS Kim
Materials Science and Engineering: A 340 (1-2), 68-79, 2003
1092003
Influence of tip bluntness on the size-dependent nanoindentation hardness
JY Kim, BW Lee, DT Read, D Kwon
Scripta materialia 52 (5), 353-358, 2005
812005
Determining representative stress and representative strain in deriving indentation flow curves based on finite element analysis
EC Jeon, MK Baik, SH Kim, BW Lee, DI Kwon
Key Engineering Materials 297, 2152-2157, 2005
492005
Nitride semiconductor based power converting device
J Woo-Chul, BW Lee, JK Shin, J Oh
US Patent 9,082,693, 2015
432015
Chip-last embedded actives and passives in thin organic package for 1–110 GHz multi-band applications
F Liu, V Sundaram, S Min, V Sridharan, H Chan, N Kumbhat, BW Lee, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
362010
Evaluation of fracture toughness using small notched specimens
BW Lee, J Jang, D Kwon
Materials Science and Engineering: A 334 (1-2), 207-214, 2002
362002
Chip-last embedded active for system-on-package (SOP)
BW Lee, V Sundaram, B Wiedenman, CK Yoon, V Kripesh, M Iyer, ...
2007 Proceedings 57th Electronic Components and Technology Conference, 292-298, 2007
322007
Multilayer laminate package and method of manufacturing the same
BW Lee, JH Lim, SW Booh
US Patent 8,872,041, 2014
302014
Experimental analysis of the practical LBZ effects on the brittle fracture performance of cryogenic steel HAZs with respect to crack arrest toughness near fusion line
J Jang, BW Lee, JB Ju, D Kwon, W Kim
Engineering Fracture Mechanics 70 (10), 1245-1257, 2003
302003
Tailoring of temperature coefficient of capacitance (TCC) in nanocomposite capacitors
BW Lee, IR Abothu, PM Raj, CK Yoon, RR Tummala
Scripta materialia 54 (7), 1231-1234, 2006
272006
Determination of microstructural criterion for cryogenic toughness variation in actual HAZs using microstructure-distribution maps
J Jang, JS Lee, JB Ju, BW Lee, D Kwon, WS Kim
Materials Science and Engineering: A 351 (1-2), 183-189, 2003
262003
Folded stacked package and method of manufacturing the same
BW Lee
US Patent 8,861,205, 2014
242014
Deformation characteristics of electroplated MEMS cantilever beams released by plasma ashing
TJ Kang, JG Kim, JH Kim, KC Hwang, BW Lee, CW Baek, YK Kim, ...
Sensors and actuators a: physical 148 (2), 407-415, 2008
232008
Semiconductor device package including bonding layer having Ag3Sn
JW Yoon, BW Lee, SW Booh, C Jeong
US Patent 9,520,377, 2016
222016
Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages
BW Lee, W Jang, DW Kim, J Jeong, JW Nah, KW Paik, D Kwon
Materials Science and Engineering: A 380 (1-2), 231-236, 2004
212004
Leakage current analysis of hydrothermal BaTiO3 thin films
PM Raj, BW Lee, D Balaraman, RR Tummala
Journal of electroceramics 27, 169-175, 2011
162011
Organic based dielectric materials and methods for minaturized RF components, and low temperature coefficient of permittivity composite devices having tailored filler materials
BW Lee, M Pulugurtha, C Yoon, R Tummala, I Abothu, S Bhattacharya
US Patent App. 11/429,780, 2006
162006
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