Bidyut  Bhattacharyya
Bidyut Bhattacharyya
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TitleCited byYear
Multi-layer molded plastic IC package
D Mallik, BK Bhattacharyya
US Patent 4,891,687, 1990
1611990
Lead grid array integrated circuit
D Mallik, BK Bhattacharyya
US Patent 5,210,939, 1993
1371993
Method of making a multilayer molded plastic IC package
D Mallik, BK Bhattacharyya
US Patent 4,835,120, 1989
1091989
De-coupling capacitor on the top of the silicon die by eutectic flip bonding
BK Bhattacharyya, D Mallik, YY You
US Patent 5,369,545, 1994
861994
High performance and high capacitance package with improved thermal dissipation
BK Bhattacharyya, S Tanahashi
US Patent 5,608,261, 1997
581997
Die surface stresses in a molded plastic package
B Natarajan, B Bhattacharyya
Proc. 36th Electronic Components Conference, 544-551, 1986
551986
Moisture absorption and mechanical performance of surface mountable plastic packages
BK Bhattacharyya, WA Huffman, WE Jahsman, B Natarajan
38th Electronics Components Conference 1988., Proceedings., 49-58, 1988
341988
Use of tantalum oxide capacitor on ceramic co-fired technology
BK Bhattacharyya, L Mosley
US Patent 5,666,004, 1997
291997
Integrated circuit having a two-dimensional lead grid array
D Mallik, BK Bhattacharyya
US Patent 5,420,461, 1995
271995
Advance multilayer molded plastic package using mesic technology
BK Bhattacharyya, D Mallik, S Ban, T Takikawa, S Yamanaka
US Patent 5,556,807, 1996
261996
Power distribution lid for IC package
BK Bhattacharyya, JD Wilson
US Patent 5,475,565, 1995
261995
Current distribution in a power and ground planes of multilayer pin grid array package
MA Schmitt
Proc. IEPC 467, 1988
261988
Multilayer molded plastic package using mesic technology
B Bhattacharyya, D Mallik
US Patent 5,488,257, 1996
231996
Alumina multilayer wiring substrate provided with high dielectric material layer
M Ogawa, K Yamasaki, M Hirano, MA Schmitt, BK Bhattacharyya
US Patent 5,099,388, 1992
231992
Swing-pay: One card meets all user payment and identity needs: A digital card module using NFC and biometric authentication for peer-to-peer payment
S Ghosh, A Majumder, J Goswami, A Kumar, SP Mohanty, ...
IEEE Consumer Electronics Magazine 6 (1), 82-93, 2017
192017
Anchor provisions to prevent mold delamination in an overmolded plastic array package
A Hassan, BK Bhattacharyya
US Patent 5,773,895, 1998
191998
High performance and high capacitance package with improved thermal dissipation
BK Bhattacharyya, S Tanahashi
US Patent 5,607,883, 1997
191997
A method of designing a group of bumps for C4 packages to maximize the number of bumps and minimize the number of package layers
NM Gasparini, BK Bhattacharyya
1994 Proceedings. 44th Electronic Components and Technology Conference, 695-699, 1994
151994
Process for bonding die to substrate using a gold/silicon seed
BK Bhattacharyya, ES Tosaya
US Patent 4,810,671, 1989
151989
Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
WM Siu, BK Bhattacharyya
US Patent 6,664,620, 2003
142003
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