| Design and fabrication of screen-printed silver circuits for stretchable electronics KS Kim, KH Jung, SB Jung Microelectronic engineering 120, 216-220, 2014 | 74 | 2014 |
| Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages KH Jung, KD Min, CJ Lee, BG Park, H Jeong, JM Koo, B Lee, SB Jung Applied Surface Science 495, 143487, 2019 | 26 | 2019 |
| Electromigration behaviors of Sn58% Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB J Kim, KH Jung, JH Kim, CJ Lee, SB Jung Journal of Alloys and Compounds 775, 581-588, 2019 | 26 | 2019 |
| Fabrication of the hybrid Ag paste combined by Ag nanoparticle and micro Ag flake and its flexibility BG Park, KH Jung, SB Jung Journal of Alloys and Compounds 699, 1186-1191, 2017 | 25 | 2017 |
| Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant KH Jung, KD Min, CJ Lee, SB Jung Journal of Alloys and Compounds 781, 657-663, 2019 | 23 | 2019 |
| Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package H Jeong, KH Jung, CJ Lee, KD Min, WR Myung, SB Jung Journal of Materials Science: Materials in Electronics 31, 6835-6842, 2020 | 15 | 2020 |
| Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics CJ Lee, BG Park, H Jeong, KH Jung, SB Jung Journal of Alloys and Compounds 794, 341-346, 2019 | 13 | 2019 |
| The critical role of Ag nanowires in the improvement of conductivity and flexibility of circuits fabricated with hybrid Ag nanopaste KS Kim, BG Park, KH Jung, SB Jung, JW Kim Journal of Materials Science: Materials in Electronics 26, 8644-8651, 2015 | 12 | 2015 |
| Characterization of Ag-Pd nanocomposite paste for electrochemical migration resistance KS Kim, KH Jung, BG Park, YE Shin, SB Jung Journal of Nanoscience and Nanotechnology 13 (11), 7620-7624, 2013 | 11 | 2013 |
| Microwave sintering of silver nanoink for radio frequency applications KS Kim, BG Park, KH Jung, JW Kim, MY Jeong, SB Jung Journal of Nanoscience and Nanotechnology 15 (3), 2333-2337, 2015 | 10 | 2015 |
| RF characteristics of flexible circuits patterned with hybrid Ag paste KH Jung, SW Kim, MK Maeng, DG Kam, SB Jung Journal of Materials Science: Materials in Electronics 29, 5074-5081, 2018 | 9 | 2018 |
| Screen-printed cu circuit for low-cost fabrication and its electrochemical migration characteristics KH Jung, KS Kim, BG Park, SB Jung Journal of Nanoscience and Nanotechnology 14 (12), 9493-9497, 2014 | 9 | 2014 |
| Ultrafast photonic soldering with Sn–58Bi using intense pulsed light energy KH Jung, KD Min, CJ Lee, H Jeong, JH Kim, SB Jung Advanced Engineering Materials 22 (12), 2000179, 2020 | 8 | 2020 |
| Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability BU Hwang, KH Jung, KD Min, CJ Lee, SB Jung Journal of Materials Science: Materials in Electronics 32, 3054-3065, 2021 | 7 | 2021 |
| Thermal and thermomechanical behaviors of the fan-out package with embedded Ag patterns KH Jung, H Jeong, CJ Lee, KD Min, SB Jung IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 7 | 2020 |
| Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi KD Min, KH Jung, CJ Lee, BU Hwang, SB Jung Journal of Alloys and Compounds 857, 157595, 2021 | 6 | 2021 |
| Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering CJ Lee, KH Jung, KD Min, BG Park, SB Jung Journal of Materials Science & Technology 53, 13-18, 2020 | 6 | 2020 |
| Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high-temperature packaging applications KD Min, KH Jung, CJ Lee, H Jeong, SB Jung Journal of Materials Science: Materials in Electronics 30, 18848-18857, 2019 | 6 | 2019 |
| Effects of polyvinylpyrrolidone molecular weight on adhesion strength of screen-printed Cu circuits to polyimide substrate KH Jung, BG Park, SB Jung Nanoscience and Nanotechnology Letters 7 (12), 999-1003, 2015 | 6 | 2015 |
| Fabrication of Ag circuit embedded in PDMS substrate and its mechanical and electrical property with variations of photonic energy KH Jung, J Kim, BG Park, CJ Lee, HJ Sung, SB Jung Journal of Alloys and Compounds 748, 898-904, 2018 | 5 | 2018 |
seung-boo jungProfessor of Materials Science and Engineering, Sungkyunkwan UniversityVerified email at skku.edu
