| Dynamics of Charging of Muscovite Mica: Measurement and Modeling PJ Sides, D Faruqui, AJ Gellman Langmuir 25 (3), 1475-1481, 2009 | 47 | 2009 |
| Soft lithography meets self-organization: Some new developments in meso-patterning (Cover Page Article) R Mukherjee, A Sharma, G Patil, D Faruqui, P Sarathi, G Pattader Bulletin of Materials Science 31 (3), 249-261, 2008 | 43 | 2008 |
| Solvent Vapor Assisted Dewetting of Pre-Patterned Thin Polymer Films: Control of Morphology, Order and Pattern Miniaturization N Bhandaru, PS Goohpattader, D Faruqui, R Mukherjee, A Sharma Langmuir 2015, 31 (10), pp 3203–3214, 2015 | 35 | 2015 |
| PATENT: Laser Die Backside Film Removal for Integrated Circuit (IC) Packaging D Faruqui, ER Prack, SL Voronov, DK Wilkinson, T Dambrauskas, ... US Patent App. 15/196,866, 2016 | 10* | 2016 |
| Laser die backside film removal for integrated circuit (ic) packaging D Faruqui, ER Prack, SL Voronov, DK Wilkinson, T Dambrauskas, ... US Patent App. 13/830,126, 2014 | 9 | 2014 |
| PATENT: Laser die backside film Removal for Integrated Circuit (IC) Packaging D Faruqui, ER Prack, SL Voronov, DK Wilkinson, T Dambrauskas, ... US Patent App. 13/830,126, 2013 | 9* | 2013 |
| Organic thin film passivation of metal interconnections A Aleksov, T Dambrauskas, D Faruqui, MS Hlad, ER Prack US Patent App. 13/977,663, 2014 | 8 | 2014 |
| PATENT: Organic Thin Film Passivation of Metal Interconnections A Aleksov, T Dambrauskas, D Faruqui, MS Hlad, ER Prack US Patent App. 13/977,663, 2011 | 8* | 2011 |
| Ablation method and recipe for wafer level underfill material patterning and removal RC Dias, LD Skoglund, AR Indluru, ER Prack, D Faruqui, TN Osborn, ... US Patent App. 14/021,938, 2015 | 5 | 2015 |
| PATENT: Ablation Method and Recipe for Wafer Level Underfill Material Patterning and Removal RC Dias, LD Skoglund, AR Indluru, ER Prack, D Faruqui, TN Osborn, ... US Patent App. 14/021,938, 2013 | 5* | 2013 |
| Stress engineered polymeric nanostructures by self-organized splitting of microstructures D Faruqui, A Sharma Industrial & Engineering Chemistry Research 47 (17), 6374-6378, 2008 | 5 | 2008 |
| Organic thin film passivation of metal interconnections A Aleksov, T Dambrauskas, D Faruqui, MS Hlad, ER Prack US Patent App. 15/018,686, 2016 | 4 | 2016 |
| PATENT: Organic Thin Film Passivation of Metal Interconnections A Aleksov, T Dambrauskas, D Faruqui, MS Hlad, ER Prack, ER Prack US Patent App. 15/018,686, 2016 | 4* | 2016 |
| Organic thin film passivation of metal interconnections A Aleksov, T Dambrauskas, D Faruqui, MS Hlad, ER Prack US Patent 9,824,991, 2017 | 3 | 2017 |
| Organic thin film passivation of metal interconnections A Aleksov, T Dambrauskas, D Faruqui, MS Hlad, ER Prack US Patent App. 15/421,340, 2017 | 3 | 2017 |
| Laser die backside film removal for integrated circuit (ic) packaging D Faruqui, ER Prack, SL Voronov, DK Wilkinson, T Dambrauskas, ... US Patent App. 15/196,866, 2016 | 3 | 2016 |
| Ultrathin microelectronic die packages and methods of fabricating the same OG Karhade, NA Deshpande, D Faruqui US Patent App. 14/266,089, 2015 | 3 | 2015 |
| BEoL Layout Design Considerations to Mitigate CPI Risk MA Rabie, T Raman, F Mirza, NA Polomoff, D Faruqui, S Pozder, ... 2018 IEEE International Interconnect Technology Conference (IITC), 64-66, 2018 | 1 | 2018 |
| Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control S Singh, M Yeung, F Mirza, T Raman, T Longenbach, J Morgan, ... Advances in Patterning Materials and Processes XXXV 10586, 1058612, 2018 | 1 | 2018 |
| PATENT: Laser Ablation Method and Recipe for Sacrificial Material Patterning and Removal RC Dias, LD Skoglund, AR Indluru, ER Prack, D Faruqui, TN Osborn US Patent App. 14/021,954, 2013 | 1* | 2013 |
