| Role of through silicon via in 3D integration: Impact on delay and power S Chandrakar, D Gupta, MK Majumder Journal of Circuits, Systems and Computers 30 (03), 2150051, 2021 | 17 | 2021 |
| Performance analysis of Cu/CNT-based TSV: Impact on crosstalk and power S Chandrakar, D Gupta, MK Majumder Journal of Computational Electronics 21 (6), 1262-1274, 2022 | 8 | 2022 |
| Signal transmission and reflection losses of cylindrical and tapered shaped TSV in 3D integrated circuits CC Sahu, S Chandrakar, MK Majumder 2020 IEEE International Symposium on Smart Electronic Systems (iSES …, 2020 | 7 | 2020 |
| Performance analysis of bump in tapered tsv: impact on crosstalk and power loss S Chandrakar, D Gupta, MK Majumder, BK Kaushik IEEE Open Journal of Nanotechnology 3, 227-235, 2022 | 5 | 2022 |
| Impact of TSV bump and redistribution layer on crosstalk delay and power loss S Chandrakar, D Gupta, MK Majumder Memories-Materials, Devices, Circuits and Systems 4, 100040, 2023 | 3 | 2023 |
| Signal integrity and power loss analysis for different bump structures in cylindrical TSV S Chandrakar, KK Das, D Gupta, MK Majumder International Symposium on VLSI Design and Test, 358-372, 2022 | 3 | 2022 |
| Hybrid Cu-CNT Composite as Interconnect Materials and Their Equivalent Models S Chandrakar, MK Majumder Nano-Interconnect Materials and Models for Next Generation Integrated …, 2023 | | 2023 |
| Reliability Concerns of TSV based 3D Integration: Impact of Interfacial Crack V Kumari, S Chandrakar, S Verma, MK Majumder IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | | 2023 |
| High-Frequency Electromagnetic Eddy Effect Modeling for Cylindrical and Tapered Bump S Chandrakar, D Gupta, MK Majumder, BK Kaushik IEEE Transactions on Electromagnetic Compatibility, 2023 | | 2023 |
| Impact of Interfacial Crack on Redistribution Layer of TSV based 3D Integration V Kumari, S CHANDRAKAR, MK Majumder | | 2023 |
| Memories-Materials, Devices, Circuits and Systems S Chandrakar, D Gupta, MK Majumder | | |
| Performance analysis of Cu/CNT based TSV: Impact on Crosstalk and Power S Chandrakar, D Gupta, MK Majumder Journal of Computational Electronics, 0 | | |
Dr. Manoj Kumar Majumder, SMIEEEIIIT Naya RaipurVerified email at iiitnr.edu.in
