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Co-authors
Murat ArcakProfessor of Electrical Engineering and Computer ScienceVerified email at eecs.berkeley.edu- Peles YoavUniversity of Central FloridaVerified email at ucf.edu
- Sandipan MishraAssociate Professor of Mechanical Engineering, Rensselaer Polytechnic InstituteVerified email at rpi.edu
- Agung JuliusDept. Electrical, Computer, and Systems EngineeringVerified email at ecse.rpi.edu
- Juan CatanoVerified email at emerson.com
- Randal BeardProfessor of Electrical and Computer Engineering, Brigham Young UniversityVerified email at byu.edu
- Dan PopaProfessor of Electrical Computer Engineering, Univ. Of LouisvilleVerified email at louisville.edu
- Gregory J. MichnaAssociate Professor of Mechanical Engineering, South Dakota State UniversityVerified email at sdstate.edu
- Richard RadkeProfessor of Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic InstituteVerified email at ecse.rpi.edu
- Liu HsuCOPPE-Rio de Janeiro Federal UniversityVerified email at coep.ufrj.br
- Sina AfshariResearch ScientistVerified email at ecosenselighting.com
- Jacopo TaniETH ZürichVerified email at ethz.ch
- Shivkumar KalyanaramanMicrosoft IndiaVerified email at microsoft.com
- Nilanjan ChakrabortyDepartment of Mechanical Engineering, Stony Brook UniversityVerified email at stonybrook.edu
- Sumit MukherjeeSenior Applied Scientist, Microsoft AI for Good Research LabVerified email at uw.edu
- Jonas BraaschRensselaer Polytechnic InstituteVerified email at rpi.edu
- Tansu AlpcanProfessor, Dept. of EEE, the University of MelbourneVerified email at unimelb.edu.au
- Tamer BaşarSwanlund Endowed Chair & CAS Professor of Electrical and Computer EngineeringVerified email at illinois.edu
- Jacob FishColumbia UniversityVerified email at columbia.edu
John T. Wen
Professor and Head, Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic Institute
Verified email at rpi.edu - Homepage