Cheryl D. Hartfield
Title
Cited by
Cited by
Year
Method for sample separation and lift-out with one cut
TM Moore, RD Kruger, C Hartfield
US Patent 6,420,722, 2002
1452002
Hardware and techniques for cross-correlative TEM and atom probe analysis
BP Gorman, D Diercks, N Salmon, E Stach, G Amador, C Hartfield
Microscopy Today 16 (4), 42-47, 2008
812008
Interface Reliability Assessments for Copper/Low-k Products
CD Hartfield, ET Ogawa, YJ Park, TC Chiu, H Guo, GB Alers, K Jow, ...
Transactions on Device and Materials Reliability, 2005
622005
Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique
SSV Kandula, CD Hartfield, PH Geubelle, NR Sottos
Thin Solid Films 516 (21), 7627-7635, 2008
522008
Making the practically impossible “Merely difficult”—Cryogenic FIB lift‐out for “Damage free” soft matter imaging
CDJ Parmenter, MW Fay, C Hartfield, HM Eltaher
Microscopy research and technique 79 (4), 298-303, 2016
252016
In situ laser processing in a scanning electron microscope
NA Roberts, GA Magel, CD Hartfield, TM Moore, JD Fowlkes, PD Rack
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 30 (4 …, 2012
212012
Method and apparatus for acquiring simultaneous and overlapping optical and charged particle beam images
TM Moore, C Hartfield, GA Magel
US Patent 8,440,969, 2013
202013
Method of improving contact resistance
J Broz, C Hartfield, E Kramer, R Pak, H Rampersad, P Coffman, S Lee
US Patent App. 10/319,213, 2004
182004
Method for chemically reworking metal layers on integrated circuit bond pads
C Hartfield, TM Moore
US Patent 6,435,398, 2002
172002
Mechanical characterization of low-K dielectric materials
TM Moore, CD Hartfield, JM Anthony, BT Ahlburn, PS Ho, MR Miller
AIP Conference Proceedings 550 (1), 431-439, 2001
172001
Probing and wire bonding of aluminum capped copper pads
G Hotchkiss, J Aronoff, J Broz, C Hartfield, R James, L Stark, W Subido, ...
2002 IEEE International Reliability Physics Symposium. Proceedings. 40th …, 2002
152002
Failure analysis of electronic material using cryogenic FIB-SEM
N Antoniou, A Graham, C Hartfield, G Amador
Conf. Proc. from 38th Int. Symp. Test. Fail. Anal, 399-405, 2012
112012
Combined electrical test and mechanical test system for thin film characterization
JJ Broz, CD Hartfield, RM Rincon
US Patent 6,752,012, 2004
112004
Acoustic Microscopy of Semiconductor Packages
CD Hartfield, TM Moore, S Brand
Microelectronics Fialure Analysis Desk Reference, 67, 2019
102019
Assembly analytical forum analytical tool roadmap white paper
R Dias, R Goruganthu, D Goyal, C Hartfield, D Hunt, D McClelland, ...
International SEMATECH, 2005
102005
Local thickness and composition analysis of TEM lamellae in the FIB
C Lang, M Hiscock, M Dawson, C Hartfield
Microelectronics Reliability 54 (9-10), 1790-1793, 2014
92014
Dielectric integrity test for flip-chip devices with Cu/low-k interconnects
C Odegard, TC Chiu, C Hartfield, V Sundararaman
Proceedings: Electrical Electronics Insulation Conference and Electrical …, 1995
91995
In-situ quantification of TEM lamella thickness and Ga implantation in the FIB
M Hiscock, M Dawson, C Lang, C Hartfield, P Statham
Microscopy and Microanalysis 20 (S3), 342-343, 2014
72014
Mechanical and electrical characterization of an IC bond pad stack using a novel in-situ methodology
CD Hartfield, JJ Broz, TM Moore
ISTFA 2003, 486-495, 2003
72003
Cellular location of thymus‐leukemia (TL) antigen as shown by immuno‐cryoultramicrotomy
C Hartfield, A McDowall, B Loveland, KF Lindahl
Journal of electron microscopy technique 18 (2), 148-156, 1991
71991
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Articles 1–20