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Jan Vaes
Jan Vaes
Program manager, VITO Flemish Institute for Technological Research (vito), Guest Prof Uni Ghent
Verified email at vito.be - Homepage
Title
Cited by
Cited by
Year
Method for producing interconnect structures for integrated circuits
C Huyghebaert, J Vaes, J Van Olmen
US Patent 8,252,659, 2012
4222012
Solvents and supporting electrolytes in the electrocatalytic reduction of CO2
M König, J Vaes, E Klemm, D Pant
Iscience 19, 135-160, 2019
2552019
3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias
B Swinnen, W Ruythooren, P De Moor, L Bogaerts, L Carbonell, ...
2006 International Electron Devices Meeting, 1-4, 2006
2552006
Recent advances in industrial CO2 electroreduction
OG Sánchez, YY Birdja, M Bulut, J Vaes, T Breugelmans, D Pant
Current Opinion in Green and Sustainable Chemistry 16, 47-56, 2019
1992019
3D stacked IC demonstration using a through silicon via first approach
J Van Olmen, A Mercha, G Katti, C Huyghebaert, J Van Aelst, E Seppala, ...
2008 IEEE International Electron Devices Meeting, 1-4, 2008
1822008
Towards highly efficient electrochemical CO2 reduction: Cell designs, membranes and electrocatalysts
RA Tufa, D Chanda, M Ma, D Aili, TB Demissie, J Vaes, Q Li, S Liu, D Pant
Applied Energy 277, 115557, 2020
1202020
Copper plating for 3D interconnects
A Radisic, O Lühn, HGG Philipsen, Z El-Mekki, M Honore, S Rodet, ...
Microelectronic Engineering 88 (5), 701-704, 2011
982011
Crystalline thin‐foil silicon solar cells: where crystalline quality meets thin‐film processing
F Dross, K Baert, T Bearda, J Deckers, V Depauw, O El Daif, I Gordon, ...
Progress in Photovoltaics: Research and Applications 20 (6), 770-784, 2012
972012
Integration challenges of copper through silicon via (TSV) metallization for 3D-stacked IC integration
J Van Olmen, C Huyghebaert, J Coenen, J Van Aelst, E Sleeckx, ...
Microelectronic Engineering 88 (5), 745-748, 2011
822011
The role of metal hydroxides in NiFe deposition
J Vaes, J Fransaer, JP Celis
Journal of the Electrochemical Society 147 (10), 3718, 2000
822000
Electroreduction of carbon dioxide into formate: A comprehensive review
SA Al‐Tamreh, MH Ibrahim, MH El‐Naas, J Vaes, D Pant, A Benamor, ...
ChemElectroChem 8 (17), 3207-3220, 2021
752021
Three novel ways of making thin-film crystalline-silicon layers on glass for solar cell applications
I Gordon, F Dross, V Depauw, A Masolin, Y Qiu, J Vaes, D Van Gestel, ...
Solar Energy Materials and Solar Cells 95, S2-S7, 2011
732011
Epoxy-induced spalling of silicon
R Martini, M Gonzalez, F Dross, A Masolin, J Vaes, D Frederickx, ...
Energy Procedia 27, 567-572, 2012
412012
Highly reliable CMOS-integrated 11MPixel SiGe-based micro-mirror arrays for high-end industrial applications
L Haspeslagh, J De Coster, OV Pedreira, I De Wolf, B Du Bois, A Verbist, ...
2008 IEEE International Electron Devices Meeting, 1-4, 2008
352008
Integration of aprotic CO 2 reduction to oxalate at a Pb catalyst into a GDE flow cell configuration
M König, SH Lin, J Vaes, D Pant, E Klemm
Faraday Discussions 230, 360-374, 2021
302021
Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance
M Nagar, J Vaes, Y Ein-Eli
Electrochimica Acta 55 (8), 2810-2816, 2010
282010
Cathodic inhibition effects during NiFe and ZnNi alloy deposition
J Vaes, J Fransaer, JP Celis
Journal of the Electrochemical Society 149 (11), C567, 2002
212002
Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurry. Part I. Elucidating slurry chemistry
M Nagar, D Starosvetsky, J Vaes, Y Ein-Eli
Electrochimica acta 55 (10), 3560-3571, 2010
202010
CMOS-integrated poly-SiGe cantilevers with read/write system for probe storage device
S Severi, J Heck, TKA Chou, N Belov, JS Park, D Harrar, A Jain, ...
TRANSDUCERS 2009-2009 International Solid-State Sensors, Actuators and …, 2009
192009
Electrochemical Conversion of CO2 from Direct Air Capture Solutions
O Gutierrez-Sanchez, B De Mot, N Daems, M Bulut, J Vaes, D Pant, ...
Energy & Fuels 36 (21), 13115-13123, 2022
162022
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Articles 1–20