Madhav Datta
Madhav Datta
Distinguished professor, Amrita Vishwa Vidyapeetham, Coimbatore
Verified email at
Cited by
Cited by
Fundamental aspects and applications of electrochemical microfabrication
M Datta, D Landolt
Electrochimica acta 45 (15-16), 2535-2558, 2000
Electrochemical metal removal technique for planarization of surfaces
M Datta, TR O'toole
US Patent 5,567,300, 1996
Electrochemical machining under pulsed current conditions
M Datta, D Landolt
Electrochimica Acta 26 (7), 899-907, 1981
Electrochemical tool for uniform metal removal during electropolishing
M Datta, LT Romankiw
US Patent 5,217,586, 1993
Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
M Datta, V Dubin, C Thomas, P McGregor
US Patent App. 09/728,683, 2002
Method and apparatus for splitting control and media content from a cellular network connection
N Labun, S Weipan, A Kobrinetz, AF Favila, P Huang, C Malek
US Patent 6,842,621, 2005
Barrier layers for electroplated SnPb eutectic solder joints
PC Andricacos, M Datta, WJ Horkans, SK Kang, KT Kwietniak
US Patent 5,937,320, 1999
Apparatus and Method for the Electrochemical Etching of a Wafer
M Datta, DC Edelstein, CE Uzoh
US Patent 6,103,096, 2000
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
M Datta, D Emory, SM Joshi, S Menezes, D Suh
US Patent 6,853,076, 2005
Electroetching method and apparatus
M Datta, RV Shenoy
US Patent 5,543,032, 1996
Microfabrication by electrochemical metal removal
M Datta
IBM journal of research and development 42 (5), 655-670, 1998
Application of chemical and electrochemical micromachining in the electronics industry
M Datta, LT Romankiw
Journal of the Electrochemical Society 136 (6), 285C, 1989
On the role of mass transport in high rate dissolution of iron and nickel in ECM electrolytes—I. Chloride solutions
M Datta, D Landolt
Electrochimica Acta 25 (10), 1255-1262, 1980
Flip-Chip interconnections using lead-free solders
PC Andricacos, M Datta, H Deligianni, WJ Horkans, SK Kang, ...
US Patent 6,224,690, 2001
Energy storage systems in electronics
T Osaka, M Datta
CRC Press, 2000
Thickness of natural oxide films determined by AES and XPS with/without sputtering
HJ Mathieu, M Datta, D Landolt
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 3 (2 …, 1985
Electrochemical micromachining: an environmentally friendly, high speed processing technology
M Datta, D Harris
Electrochimica Acta 42 (20-22), 3007-3013, 1997
Anodic dissolution of metals at high rates
M Datta
IBM Journal of Research and Development 37 (2), 207-226, 1993
Microelectronic packaging
M Datta, T Osaka, JW Schultze
CRC press, 2004
Method of electroless introduction of interconnect structures
VM Dubin, CD Thomas, P McGregor, M Datta
US Patent 6,977,224, 2005
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