| Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor YN Prasad, S Ramanathan Electrochimica Acta 52 (22), 6353-6358, 2007 | 90 | 2007 |
| Characterization of TMAH based cleaning solution for post Cu-CMP application RP Venkatesh, TY Kwon, YN Prasad, S Ramanathan, JG Park Microelectronic engineering 102, 74-80, 2013 | 64 | 2013 |
| Selection and optimization of corrosion inhibitors for improved Cu CMP and post-Cu CMP cleaning HY Ryu, BJ Cho, NP Yerriboina, CH Lee, JK Hwang, S Hamada, Y Wada, ... ECS Journal of Solid State Science and Technology 8 (5), P3058, 2019 | 44 | 2019 |
| Generation of pad debris during oxide CMP process and its role in scratch formation YN Prasad, TY Kwon, IK Kim, IG Kim, JG Park Journal of the Electrochemical Society 158 (4), H394, 2011 | 41 | 2011 |
| Analysis of scratches formed on oxide surface during chemical mechanical planarization JG Choi, YN Prasad, IK Kim, IG Kim, WJ Kim, AA Busnaina, JG Park Journal of The Electrochemical Society 157 (2), H186, 2009 | 34 | 2009 |
| Investigation of the effect of different cleaning forces on Ce-O-Si bonding during oxide post-CMP cleaning S Sahir, NP Yerriboina, SY Han, KM Han, TG Kim, N Mahadev, JG Park Applied Surface Science 545, 149035, 2021 | 33 | 2021 |
| A breakthrough method for the effective conditioning of PVA brush used for post-CMP process JH Lee, HY Ryu, JK Hwang, NP Yerriboina, TG Kim, S Hamada, Y Wada, ... ECS Journal of Solid State Science and Technology 8 (6), P307, 2019 | 28 | 2019 |
| Role of amino-acid adsorption on silica and silicon nitride surfaces during STI CMP YN Prasad, S Ramanathan Electrochemical and solid-state letters 9 (12), G337, 2006 | 27 | 2006 |
| Contamination mechanism of ceria particles on the oxide surface after the CMP process KM Han, SY Han, S Sahir, NP Yerriboina, TG Kim, N Mahadev, JG Park ECS Journal of Solid State Science and Technology 9 (12), 124004, 2020 | 25 | 2020 |
| Synthesis of Fe metal precipitated colloidal silica and its application to W chemical mechanical polishing (CMP) slurry YJ Kang, YN Prasad, IK Kim, SJ Jung, JG Park Journal of colloid and interface science 349 (1), 402-407, 2010 | 22 | 2010 |
| The adhesion and removal mechanism of ceria particles for STI post-CMP cleaning process NP Yerriboina, S Sahir, SY Han, KM Han, JG Park ECS Transactions 92 (2), 157, 2019 | 20 | 2019 |
| Tungsten passivation layer (WO3) formation mechanisms during chemical mechanical planarization in the presence of oxidizers MK Poddar, P Jalalzai, S Sahir, NP Yerriboina, TG Kim, JG Park Applied Surface Science 537, 147862, 2021 | 19 | 2021 |
| Electrochemical impedance spectroscopic studies of copper dissolution in arginine–hydrogen peroxide solutions Y Nagendra Prasad, V Vinod Kumar, S Ramanathan Journal of Solid State Electrochemistry 13, 1351-1359, 2009 | 19 | 2009 |
| Effect of polysilicon wettability on polishing and organic defects during CMP JG Park, YN Prasad, YJ Kang, IK Kim, YK Hong, SY Han, SK Yun, ... Journal of the Electrochemical Society 156 (11), H869, 2009 | 18 | 2009 |
| Post-CMP cleaning of InGaAs surface for the removal of nanoparticle contaminants for Sub-10nm device applications IC Choi, HT Kim, NP Yerriboina, JH Lee, L Teugels, TG Kim, JG Park ECS Journal of Solid State Science and Technology 8 (5), P3028, 2019 | 17 | 2019 |
| Nanocatalyst-induced hydroxyl radical (·OH) slurry for tungsten CMP for next-generation semiconductor processing MK Poddar, HY Ryu, NP Yerriboina, YA Jeong, JH Lee, TG Kim, JH Kim, ... Journal of materials science 55, 3450-3461, 2020 | 16 | 2020 |
| Study on possible root causes of contamination from an incoming PVA brush during post-CMP cleaning JH Lee, M Purushothaman, KM Han, HY Ryu, NP Yerriboina, TG Kim, ... Polymer Testing 77, 105921, 2019 | 15 | 2019 |
| The synergetic role of pores and grooves of the pad on the scratch formation during STI CMP JG Choi, YN Prasad, IK Kim, WJ Kim, JG Park Journal of The Electrochemical Society 157 (8), H806, 2010 | 15 | 2010 |
| Comparative evaluation of organic contamination sources from roller and pencil type PVA brushes during the Post-CMP cleaning process JH Lee, MK Poddar, KM Han, HY Ryu, NP Yerriboina, TG Kim, Y Wada, ... Polymer Testing 90, 106669, 2020 | 14 | 2020 |
| Ultrasound-induced break-in method for an incoming polyvinyl acetal (PVA) brush used during post-CMP cleaning process JH Lee, MK Poddar, NP Yerriboina, HY Ryu, KM Han, TG Kim, S Hamada, ... Polymer Testing 78, 105962, 2019 | 14 | 2019 |
