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Amir Sajjad Bahman
Amir Sajjad Bahman
Associate Professor, Aalborg University
Verified email at energy.aau.dk - Homepage
Title
Cited by
Cited by
Year
A lumped thermal model including thermal coupling and thermal boundary conditions for high-power IGBT modules
AS Bahman, K Ma, F Blaabjerg
IEEE Transactions on Power Electronics 33 (3), 2518-2530, 2017
2382017
Complete loss and thermal model of power semiconductors including device rating information
K Ma, AS Bahman, S Beczkowski, F Blaabjerg
IEEE Transactions on Power Electronics 30 (5), 2556-2569, 2014
2002014
A 3-D-lumped thermal network model for long-term load profiles analysis in high-power IGBT modules
AS Bahman, K Ma, P Ghimire, F Iannuzzo, F Blaabjerg
IEEE Journal of Emerging and Selected Topics in Power Electronics 4 (3 …, 2016
1732016
A review on IGBT module failure modes and lifetime testing
A Abuelnaga, M Narimani, AS Bahman
IEEE access 9, 9643-9663, 2021
942021
Mission-Profile-Based Lifetime Prediction for a SiC mosfet Power Module Using a Multi-Step Condition-Mapping Simulation Strategy
L Ceccarelli, RM Kotecha, AS Bahman, F Iannuzzo, HA Mantooth
IEEE Transactions on Power Electronics 34 (10), 9698-9708, 2019
742019
Thermal impedance model of high power IGBT modules considering heat coupling effects
AS Bahman, K Ma, F Blaabjerg
2014 International Power Electronics and Application Conference and …, 2014
732014
Active Power Cycling Test Bench for SiC Power MOSFET s—Principles, Design, and Implementation
S Baba, A Gieraltowski, M Jasinski, F Blaabjerg, AS Bahman, ...
IEEE Transactions on Power Electronics 36 (3), 2661-2675, 2020
432020
Optimization tool for direct water cooling system of high power IGBT modules
AS Bahman, F Blaabjerg
2016 18th European Conference on Power Electronics and Applications (EPE'16 …, 2016
432016
Mission-profile-based stress analysis of bond-wires in SiC power modules
AS Bahman, F Iannuzzo, F Blaabjerg
Microelectronics reliability 64, 419-424, 2016
382016
A modification of offset strip fin heatsink with high-performance cooling for IGBT modules
A Yahyaee, AS Bahman, F Blaabjerg
Applied sciences 10 (3), 1112, 2020
352020
Power electronic converter reliability and prognosis review focusing on power switch module failures
A Abuelnaga, M Narimani, AS Bahman
Journal of Power Electronics 21 (6), 865-880, 2021
332021
Modeling of short-circuit-related thermal stress in aged IGBT modules
AS Bahman, F Iannuzzo, C Uhrenfeldt, F Blaabjerg, S Munk-Nielsen
IEEE Transactions on Industry Applications 53 (5), 4788-4795, 2017
332017
A fast electro-thermal co-simulation modeling approach for SiC power MOSFETs
L Ceccarelli, AS Bahman, F Iannuzzo, F Blaabjerg
2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 966-973, 2017
332017
Compact sandwiched press-pack SiC power module with low stray inductance and balanced thermal stress
Y Chang, H Luo, F Iannuzzo, AS Bahman, W Li, X He, F Blaabjerg
IEEE Transactions on Power Electronics 35 (3), 2237-2241, 2019
292019
General 3D lumped thermal model with various boundary conditions for high power IGBT modules
AS Bahman, K Ma, F Blaabjerg
2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 261-268, 2016
292016
Frozen leg operation of a three-phase dual active bridge converter
S Haghbin, F Blaabjerg, AS Bahman
IEEE Transactions on Power Electronics 34 (5), 4239-4248, 2018
262018
Electrical parasitics and thermal modeling for optimized layout design of high power SiC modules
AS Bahman, F Blaabjerg, A Dutta, A Mantooth
2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 3012-3019, 2016
262016
Lifetime analysis of metallized polypropylene capacitors in modular multilevel converter based on finite element method
R Yao, H Li, W Lai, AS Bahman, F Iannuzzo
IEEE Journal of Emerging and Selected Topics in Power Electronics 9 (4 …, 2020
232020
Lifetime estimation and failure risk analysis in a power stage used in wind-fuel cell hybrid energy systems
S Rastayesh, S Bahrebar, AS Bahman, JD Sørensen, F Blaabjerg
Electronics 8 (12), 1412, 2019
222019
Computer-aided engineering simulations
AS Bahman, F Iannuzzo
Wide Bandgap Power Semiconductor Packaging, 199-223, 2018
222018
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