Ultrahigh strength and high electrical conductivity in copper L Lu, Y Shen, X Chen, L Qian, K Lu Science 304 (5669), 422-426, 2004 | 3942 | 2004 |
Strengthening materials by engineering coherent internal boundaries at the nanoscale K Lu, L Lu, S Suresh science 324 (5925), 349-352, 2009 | 2909 | 2009 |
Revealing the maximum strength in nanotwinned copper L Lu, X Chen, X Huang, K Lu Science 323 (5914), 607-610, 2009 | 2024 | 2009 |
Revealing extraordinary intrinsic tensile plasticity in gradient nano-grained copper TH Fang, WL Li, NR Tao, K Lu Science 331 (6024), 1587-1590, 2011 | 1514 | 2011 |
Nanostructured surface layer on metallic materials induced by surface mechanical attrition treatment K Lu, J Lu Materials Science and Engineering: A 375, 38-45, 2004 | 1289 | 2004 |
An investigation of surface nanocrystallization mechanism in Fe induced by surface mechanical attrition treatment NR Tao, ZB Wang, WP Tong, ML Sui, J Lu, K Lu Acta materialia 50 (18), 4603-4616, 2002 | 1282 | 2002 |
Dislocation nucleation governed softening and maximum strength in nano-twinned metals X Li, Y Wei, L Lu, K Lu, H Gao Nature 464 (7290), 877-880, 2010 | 1166 | 2010 |
Nanocrystalline metals crystallized from amorphous solids: nanocrystallization, structure, and properties K Lu Materials Science and Engineering: R: Reports 16 (4), 161-221, 1996 | 1070 | 1996 |
Superplastic extensibility of nanocrystalline copper at room temperature L Lu, ML Sui, K Lu Science 287 (5457), 1463-1466, 2000 | 1010 | 2000 |
Making strong nanomaterials ductile with gradients K Lu Science 345 (6203), 1455-1456, 2014 | 965 | 2014 |
Surface nanocrystallization (SNC) of metallic materials-presentation of the concept behind a new approach LU Ke, LU Jian Journal of Materials Sciences and Technology 15 (03), 193, 1999 | 961 | 1999 |
Nitriding iron at lower temperatures WP Tong, NR Tao, ZB Wang, J Lu, K Lu Science 299 (5607), 686-688, 2003 | 837 | 2003 |
Formation of nanostructured surface layer on AISI 304 stainless steel by means of surface mechanical attrition treatment HW Zhang, ZK Hei, G Liu, J Lu, K Lu Acta materialia 51 (7), 1871-1881, 2003 | 830 | 2003 |
Nano-sized twins induce high rate sensitivity of flow stress in pure copper L Lu, R Schwaiger, ZW Shan, M Dao, K Lu, S Suresh Acta materialia 53 (7), 2169-2179, 2005 | 776 | 2005 |
Stabilizing nanostructures in metals using grain and twin boundary architectures K Lu Nature Reviews Materials 1 (5), 1-13, 2016 | 731 | 2016 |
Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures YS Li, NR Tao, K Lu Acta Materialia 56 (2), 230-241, 2008 | 694 | 2008 |
The future of metals K Lu Science 328 (5976), 319-320, 2010 | 691 | 2010 |
Melting and superheating of crystalline solids: From bulk to nanocrystals QS Mei, K Lu Progress in Materials Science 52 (8), 1175-1262, 2007 | 682 | 2007 |
Tensile properties of copper with nano-scale twins YF Shen, L Lu, QH Lu, ZH Jin, K Lu Scripta Materialia 52 (10), 989-994, 2005 | 668 | 2005 |
Grain boundary stability governs hardening and softening in extremely fine nanograined metals J Hu, YN Shi, X Sauvage, G Sha, K Lu Science 355 (6331), 1292-1296, 2017 | 665 | 2017 |