| Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure AK Panigrahi, S Bonam, T Ghosh, SG Singh, SRK Vanjari Materials Letters 169, 269-272, 2016 | 52 | 2016 |
| Interface and reliability analysis of Au-passivated Cu–Cu fine-pitch thermocompression bonding for 3-D IC applications S Bonam, AK Panigrahi, CH Kumar, SRK Vanjari, SG Singh IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (7 …, 2019 | 42 | 2019 |
| Low temperature, low pressure CMOS compatible Cu-Cu thermo-compression bonding with Ti passivation for 3D IC integration AK Panigrahi, S Bonam, T Ghosh, SRK Vanjari, SG Singh 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2205-2210, 2015 | 27 | 2015 |
| High quality fine-pitch Cu-Cu wafer-on-wafer bonding with optimized Ti passivation at 160° C AK Panigrahi, S Bonam, T Ghosh, SRK Vanjari, SG Singh 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1791-1796, 2016 | 14 | 2016 |
| Metal-alloy Cu surface passivation leads to high quality fine-pitch bump-less Cu-Cu bonding for 3D IC and heterogeneous integration applications AK Panigrahi, CH Kumar, S Bonam, PK Brince, T Ghosh, N Paul, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1561-1566, 2018 | 12 | 2018 |
| Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu–Cu bonding at sub 200° C for three-dimensional Integration applications AK Panigrahi, CH Kumar, S Bonam, T Ghosh, SRK Vanjari, SG Singh Japanese Journal of Applied Physics 57 (2S1), 02BC04, 2017 | 12 | 2017 |
| Flexible polymer-based triboelectric nanogenerator using Poly (vinylidene fluoride) and bombyx mori silk L Sarkar, AB Kandala, S Bonam, S Mohanty, SG Singh, SRK Vanjari Materials Today Sustainability 20, 100230, 2022 | 11 | 2022 |
| Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding AK Panigrahi, S Bonam, T Ghosh, SRK Vanjari, SG Singh 2015 International 3D Systems Integration Conference (3DIC), TS8. 13.1-TS8. 13.5, 2015 | 7 | 2015 |
| Effect of ultrathin palladium layer in achieving a low temperature and pressure wafer level aluminum to aluminum bonding HK Cheemalamarri, S Bonam, SRK Vanjari, SG Singh Surface Topography: Metrology and Properties 8 (4), 045008, 2020 | 6 | 2020 |
| Diffusion enhanced drive sub 100 C wafer level fine-pitch cu-cu thermocompression bonding for 3D IC integration AK Panigrahy, S Bonam, T Ghosh, SRK Vanjari, SG Singh 2019 IEEE 69th electronic components and technology conference (ECTC), 2156-2161, 2019 | 5 | 2019 |
| Humidity-Independent Methane Gas Detection in Gd0.2La0.2Ce0.2Hf0.2Zr0.2O₂-Based Sensor Using Polynomial Regression Analysis VR Naganaboina, S Bonam, M Anandkumar, AS Deshpande, SG Singh IEEE Electron Device Letters 43 (12), 2153-2156, 2022 | 4 | 2022 |
| Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration S Patil, AK Panigrahi, S Bonam, CH Kumar, OK Singh, SG Singh 2016 IEEE International 3D Systems Integration Conference (3DIC), 1-4, 2016 | 4 | 2016 |
| Device-Physics Realization of ZnO–MWCNT Nanostructure-Based Field-Effect Biosensor for Ultrasensitive Simultaneous Genomic Detection of Foodborne Pathogens PP Goswami, S Bonam, K Jeyaram, SG Singh Analytical Chemistry 95 (39), 14695-14701, 2023 | 3 | 2023 |
| Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding S Bonam, J Joseph, CH Kumar, AK Panigrahi, SRK Vanjari, SG Singh IEEE Transactions on Semiconductor Manufacturing 35 (4), 626-632, 2022 | 3 | 2022 |
| Achieving of intensified conductive interconnections for Flex-on-Flex by using metal passivated Copper–Copper Thermocompression bonding CH Kumar, S Bonam, N Paul, SRK Vanjari, SG Singh 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1732-1737, 2018 | 3 | 2018 |
| Fabrication and characterization of suspended La0. 7Sr0. 3MnO3 nanofibers for high-sensitive and fast-responsive infrared bolometer N Paul, S Vadnala, S Bonam, A Agrawal, SRK Vanjari, SG Singh Journal of Micromechanics and Microengineering 33 (12), 125008, 2023 | 2 | 2023 |
| Silk piezoelectric tactile sensors: The way forward to developing intelligent implantable sensors S Bonam, J Joseph, A Bhagavathi, SG Singh, SRK Vanjari 2022 IEEE International Symposium on Circuits and Systems (ISCAS), 2225-2228, 2022 | 2 | 2022 |
| Ti/Si interface enabling complementary metal oxide semiconductor compatible, high reliable bonding for inter-die micro-fluidic cooling for future advanced 3D integrated circuit … HK Cheemalamarri, S Bonam, SRK Vanjari, SG Singh Journal of Micromechanics and Microengineering 30 (10), 105005, 2020 | 2 | 2020 |
| Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC K Khurram, AK Panigrahi, S Bonam, OK Singh, SG Singh 2016 IEEE International 3D Systems Integration Conference (3DIC), 1-4, 2016 | 2 | 2016 |
| Improved chemiresistor gas sensing response by optimizing the applied electric field and interdigitated electrode geometry VR Naganaboina, S Bonam, M Anandkumar, AS Deshpande, SG Singh Materials Chemistry and Physics 305, 127975, 2023 | 1 | 2023 |
Shiv Govind SinghProfessor, Electrical Engineering, IITHyderabadVerified email at ee.iith.ac.in
