Tianjian Lu (卢天荐)
Tianjian Lu (卢天荐)
Google Inc., University of Illinois at Urbana-Champaign
Verified email at google.com
TitleCited byYear
Microwave purification of large-area horizontally aligned arrays of single-walled carbon nanotubes
X Xie, SH Jin, MA Wahab, AE Islam, C Zhang, F Du, E Seabron, T Lu, ...
Nature communications 5, 5332, 2014
342014
Electrical-thermal co-simulation for DC IR-drop analysis of large-scale power delivery
T Lu, JM Jin
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (2 …, 2013
282013
Transient electrical-thermal analysis of 3-D power distribution network with FETI-enabled parallel computing
T Lu, JM Jin
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014
252014
Electrical-thermal co-simulation for analysis of high-power RF/microwave components
T Lu, JM Jin
IEEE Transactions on Electromagnetic Compatibility 59 (1), 93-102, 2016
232016
High-speed channel modeling with machine learning methods for signal integrity analysis
T Lu, J Sun, K Wu, Z Yang
IEEE Transactions on Electromagnetic Compatibility, 2018
202018
Thermal-aware high-frequency characterization of large-scale through-silicon-via structures
T Lu, JM Jin
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (6 …, 2014
202014
Through-wall imaging: Application of subspace-based optimization method
T Lu, K Agarwal, Y Zhong, X Chen
Progress In Electromagnetics Research 102, 351-366, 2010
152010
Multiphysics simulation of 3-D ICs with integrated microchannel cooling
T Lu, F Zhang, JM Jin
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016
102016
Coupled electrical–thermal–mechanical simulation for the reliability analysis of large-scale 3-D interconnects
T Lu, JM Jin
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (2 …, 2017
92017
Transient simulation for high-speed channels with recurrent neural network
T Nguyen, T Lu, J Sun, Q Le, K Wu, J Schut-Aine
27th Conference on Electrical Performance of Electronic Packaging and Systems, 2018
42018
Multiphysics simulation for the reliability analysis of large-scale interconnects
T Lu, JM Jin
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 215-217, 2016
32016
Background condition effect and modified SOM with frequency hopping applied in inverse scattering
T Lu, X Chen
2009 Asia Pacific Microwave Conference, 976-979, 2009
32009
High-speed channel modeling with deep neural network for signal integrity analysis
T Lu, K Wu, Z Yang, J Sun
22017
Electrical-thermal co-simulation for DC IR-drop analysis of large-scale integrated circuits
T Lu, JM Jin
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging …, 2013
22013
Fast transient simulation of high-speed channels using recurrent neural network
T Nguyen, T Lu, K Wu, J Schutt-Aine
http://arxiv.org/abs/1902.02627, 2019
12019
Modeling capacitor derating in power integrity simulation
T Lu, K Wu, Z Yang, JM Jin
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017
12017
Fast and accurate current prediction in packages using neural networks
Y Liu, T Lu, JY Kim, K Wu, JM Jin
2019 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2019
2019
Machine learning methods in high-speed channel modeling
T Lu, K Wu
DesignCon 2019, Santa Clara, CA, 2019
2019
Multiphysics modeling of voice coil actuators with recurrent neural network
T Lu, M Smedegaard, K Wu
2019
Simulation and characterization of singing capacitors in consumer electronics
T Lu, M Ding, K Wu
2019 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2019
2019
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Articles 1–20