| Ultra-thin and smooth transparent electrode for flexible and leakage-free organic light-emitting diodes KH Ok, J Kim, SR Park, Y Kim, CJ Lee, SJ Hong, MG Kwak, N Kim, ... Scientific reports 5 (1), 9464, 2015 | 209 | 2015 |
| Inverted layer‐by‐layer fabrication of an ultraflexible and transparent Ag nanowire/conductive polymer composite electrode for use in high‐performance organic solar cells Y Kim, TI Ryu, KH Ok, MG Kwak, S Park, NG Park, CJ Han, BS Kim, MJ Ko, ... Advanced Functional Materials 25 (29), 4580-4589, 2015 | 159 | 2015 |
| A wearable piezocapacitive pressure sensor with a single layer of silver nanowire-based elastomeric composite electrodes B You, CJ Han, Y Kim, BK Ju, JW Kim Journal of materials chemistry A 4 (27), 10435-10443, 2016 | 144 | 2016 |
| The joint characteristics of friction stir welded AZ91D magnesium alloy WB Lee, JW Kim, YM Yeon, SB Jung Materials Transactions 44 (5), 917-923, 2003 | 117 | 2003 |
| Experimental and finite element analysis of the shear speed effects on the Sn–Ag and Sn–Ag–Cu BGA solder joints JW Kim, SB Jung Materials Science and Engineering: A 371 (1-2), 267-276, 2004 | 106 | 2004 |
| Lap joint properties of FSWed dissimilar formed 5052 Al and 6061 Al alloys with different thickness CY Lee, WB Lee, JW Kim, DH Choi, YM Yeon, SB Jung Journal of Materials Science 43, 3296-3304, 2008 | 105 | 2008 |
| Highly stretchable and mechanically stable transparent electrode based on composite of silver nanowires and polyurethane–urea DH Kim, KC Yu, Y Kim, JW Kim ACS Applied Materials & Interfaces 7 (28), 15214-15222, 2015 | 101 | 2015 |
| Intense-pulsed-light irradiation of Ag nanowire-based transparent electrodes for use in flexible organic light emitting diodes CH Song, KH Ok, CJ Lee, Y Kim, MG Kwak, CJ Han, N Kim, BK Ju, ... Organic Electronics 17, 208-215, 2015 | 93 | 2015 |
| Transparent and flexible film for shielding electromagnetic interference DH Kim, Y Kim, JW Kim Materials and Design 89, 703-707, 2016 | 87 | 2016 |
| Highly stretchable and waterproof electroluminescence device based on superstable stretchable transparent electrode B You, Y Kim, BK Ju, JW Kim ACS Applied Materials & Interfaces 9 (6), 5486-5494, 2017 | 70 | 2017 |
| Photoenhanced Patterning of Metal Nanowire Networks for Fabrication of Ultraflexible Transparent Devices CH Song, CJ Han, BK Ju, JW Kim ACS Applied Materials & Interfaces 8, 480-489, 2016 | 67 | 2016 |
| Silver nanowire networks embedded in urethane acrylate for flexiblecapacitive touch sensor Y Kim, JW Kim Applied Surface Science 363, 1-6, 2016 | 66 | 2016 |
| Extremely rapid and simple healing of a transparent conductor based on Ag nanowires and polyurethane with a Diels–Alder network K Pyo, DH Lee, Y Kim, JW Kim Journal of Materials Chemistry C 4, 972, 2016 | 63 | 2016 |
| Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn–3.0 Ag–0.5 Cu solder and Ni–P UBM DG Kim, JW Kim, SB Jung Materials Science and Engineering: B 121 (3), 204-210, 2005 | 60 | 2005 |
| Evaluation of solder joint reliability in flip-chip packages during accelerated testing JW Kim, DG Kim, WS Hong, SB Jung Journal of electronic materials 34, 1550-1557, 2005 | 52 | 2005 |
| Reexamination of the solder ball shear test for evaluation of the mechanical joint strength JW Kim, SB Jung International Journal of Solids and Structures 43 (7-8), 1928-1945, 2006 | 47 | 2006 |
| Effects of number of reflows on the mechanical and electrical properties of BGA package BI Noh, JM Koo, JW Kim, DG Kim, JD Nam, J Joo, SB Jung Intermetallics 14 (10-11), 1375-1378, 2006 | 45 | 2006 |
| Evaluation of displacement rate effect in shear test of Sn–3Ag–0.5 Cu solder bump for flip chip application JW Kim, DG Kim, SB Jung Microelectronics Reliability 46 (2-4), 535-542, 2006 | 44 | 2006 |
| Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application DG Kim, JW Kim, JG Lee, H Mori, DJ Quesnel, SB Jung Journal of alloys and compounds 395 (1-2), 80-87, 2005 | 42 | 2005 |
| Reliability of adhesive interconnections for application in display module JW Kim, YC Lee, DG Kim, SB Jung Microelectronic Engineering 84 (11), 2691-2696, 2007 | 41 | 2007 |
seung-boo jungProfessor of Materials Science and Engineering, Sungkyunkwan UniversityVerified email at skku.edu
