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thomas j websterPurdue University, Brown University, Northeastern University, Hebei University of TechnologyVerified email at brown.edu
Brian W SheldonBrown UniversityVerified email at brown.edu
Haoran LiuHokkaido UniversityVerified email at eis.hokudai.ac.jp
Yuekun Lai(赖跃坤)Fuzhou University; Soochow University; Muenster University; NanyangVerified email at suda.edu.cn
Sarit B BhaduriUniversity of ToledoVerified email at utoledo.edu
Tao ChenSoochow UniversityVerified email at suda.edu.cn
Changlu XuUniversity of California, Los AngelesVerified email at ucla.edu
Lili TanInstitute of Metal Research, Chinese Academy of SciencesVerified email at imr.ac.cn
Qunyang LiAssociate Professor, Department of Engineering Mechanics, Tsinghua UniversityVerified email at tsinghua.edu.cn
Chengkuo LeeGlobalFoundries Chair Professor in Eng., ECE Department, National University of SingaporeVerified email at nus.edu.sg
Viswanath ChinthapentaAssociate Professor, MAE, IIT HyderabadVerified email at mae.iith.ac.in
Joachim Hossick SchottDistinguished Scientist at Medtronic - RetiredVerified email at medtronic.com
Yuan LinDepartment of Mechanical Engineering, The University of Hong KongVerified email at hku.hk
Phong A. TranGroup leader, Interface Science and Materials Engineering, Queensland University of TechnologyVerified email at qut.edu.au
Sirinrath SirivisootVerified email at mail.kmutt.ac.th
Ze Gong (公泽)University of Science and Technology of ChinaVerified email at ustc.edu.cn
Jing LuBrown UniversityVerified email at illumina.com
Rajesh ParetaTerumo BCT, Inc.Verified email at wakehealth.edu
Xingcheng XiaoTechnical Fellow, General Motors R&D CenterVerified email at gm.com
Haipei LiuUnibas, ETHVerified email at unibas.ch