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Hong JiangUniversity of Texas at ArlingtonVerified email at uta.edu
Pengfei ZuoHuawei CloudVerified email at hust.edu.cn
Wen XiaHarbin Institute of Technology, ShenzhenVerified email at hit.edu.cn
Xue (Steve) LiuFellow CAE; FIEEE; Prof. & William Dawson Scholar, McGill Univ.; VP R&D, Chief Scientist Samsung AIVerified email at cs.mcgill.ca
Min FuTencentVerified email at tencent.com
Bin Xiao (肖斌)Prof. of Dept. of Computing, The Hong Kong Polytechnic University, 香港理工大学Verified email at comp.polyu.edu.hk
Lei TianStaff Engineer in TintriVerified email at tintri.com
Wenbo HeAssociate Professor of Department of Computing and Software, McMaster UniversityVerified email at mcmaster.ca
Xubin HeTemple UniversityVerified email at temple.edu
Nan ZhuMcGill UniversityVerified email at mail.mcgill.ca
Fred DouglisPeraton LabsVerified email at Peratonlabs.com
Philip ShilaneDell TechnologiesVerified email at dell.com
Yuan XieProfessor of University of California at Santa BarbaraVerified email at ece.ucsb.edu
Yiran ChenProfessor, Electrical and Computer Engineering, Duke UniversityVerified email at duke.edu
Ming ZhaoAssociate Professor, Arizona State UniversityVerified email at asu.edu
Bharadwaj VeeravalliNUS, SingaporeVerified email at nus.edu.sg
Jianping WangCity University of Hong KongVerified email at cityu.edu.hk
Song JiangUniversity of Texas, ArlingtonVerified email at uta.edu
Jie LiuHarbin Institute of Technology (Shenzhen)Verified email at hit.edu.cn